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Latch replacement kit
I claim: 1. A kit for repairing a damaged latch of a connector assembly lock wherein a barrel-type plug of one connector which contains a catch of the lock inserts into ...
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Electrical connector assembly having an anti-decoupling device
We claim: 1. An electrical connector assembly having an anti-decoupling device comprising: first and second shells (100, 200), said first shell (100) having an annular ...
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Semiconductor device with protective means against overheating
It is an object of the present invention to provide a semiconductor device which has a circuit section and means which can effectively detect an excessive temperature ...
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Multi-purpose handle/prop for pen-based computer
Accordingly, one object of the present invention is to provide a convenient handle/prop arrangement for a pen-based computer that will permit both carrying and ...
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Temperature measuring apparatus
In the FIGURE, a positive power supply terminal 10 supplies power to a differential amplifier 12 and to a constant current generator generally designated as 14. A ...
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Heat pipe cooling for semiconductor device packaging system
This invention improves the prior art by the provision of a cooling frame or supporting carrier for a plurality of the heat pipes attached thereto and spanning the space ...
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Heat dissipating circuit board assembly
One object of the present invention is to provide an overall circuit board assembly including a circuit board, specifically a printed circuit board, which is especially ...
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Detection of catastrophic failure of dielectric, improper connection, and temperature of a printed circuit assembly via one wire
The present invention allows the detection of the catastrophic failure of the dielectric within a multilayer printed circuit assembly. Such detection requires one wire, ...
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Fluid-cooled integrated circuit package
The present invention is directed to a low profile package for high density integrated circuits with liquid cooling for the efficient removal of waste heat caused by ...
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Temperature monitoring system for air-cooled electric components
The present invention is directed to a method and apparatus for direct measurement of temperature and pressure for integrated circuit boards. According to the present ...
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