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Method and apparatus for forming a rupture disk
Accordingly, the present invention is directed to a pressure relief assembly that obviates one or more of the limitations and disadvantages of prior art pressure relief ...
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Forming tool
OF A PREFERRED EMBODIMENT OF THE INVENTION In the following, an embodiment will be described in which the forming tool is used for forming sheet-metal blanks for the ...
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Process for producing printed wiring board
It is an object of this invention to provide a process for producing a base board with a special structure overcoming the defects of the prior art technique. This ...
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Method for forming traces on side edges of printed circuit boards and devices formed thereby
It is an object of the invention to provide traces on the side edge of a printed circuit board which avoids the problems of surface defined traces of the type noted ...
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Circuit board assembly and method of fabricating same
The present invention provides a circuit board assembly that defines structural features that allow for improved stability in the connection between two boards. In one ...
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Module substrate and method of producing the same
Accordingly, it is an object of the present invention to provide a module substrate of which the end-face electrodes can be securely connected to a mother board even if ...
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Method of attaching a fastening element to a panel
The improved method of attaching a fastening element to a panel of this invention is particularly, but not exclusively adapted for permanent installation of fastening ...
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Self-riveting fastening element
As described above, the improved self-riveting fastening element of this invention is designed for permanent attachment to a metal panel or plate within a panel opening ...
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Solid electrolytic capacitor and method for manufacturing the same
In order to address these problems, according to the present invention, a method for manufacturing a solid electrolytic capacitor including an anode conductor that is ...
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Void free, silicon filled trenches in semiconductors
One or more embodiments of the present invention provide methods of forming substantially void free trench structures in semiconductor devices. In accordance with one ...
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