Home | Links | Contact Us | More About Intellectual Property | Bookmark

Search patents:

Home

Metal Working

Heat-dissipating-circuit-board-assembly

Portable apparatus having detachable storage unit with a lock mechanism operating a switch controlling power to the storage unit

It is an object of the present invention to provide a portable apparatus in which the lock of a ...

Connector device for computers

The inventive connector device provides an inexpensive and simple approach to connecting a laptop ...

Capacitor and element therefor

What is claimed is: 1. A capacitor comprising: a cylindrical case open at one end and closed at the ...

Multiple input output electrical isolation for use with electronic integrated circuits

OF THE PREFERRED EMBODIMENT The present invention provides multiple isolation devices on a single ...

On-chip pressure transducer and temperature compensation circuit therefor

OF THE INVENTION Pressure transducers typically are a piezoresistive pressure sensing element such ...

Monolithic integrated circuit having common external terminal for analog and digital signals and digital system using the same

It is, therefore, an object of the present invention to provide a semiconductor integrated circuit ...

Common bus multinode sensor system

It is an object of the present invention to provide a communications system that allows slow speed ...

Temperature sensitive astable multivibrator

What is claimed is: 1. A temperature sensitive semiconductor device comprising in combination: an ...

Unsinkable bag provided with flotation elements in the handles and bag compartments

The present invention relates to a bag or sack of the nonrigid type made of waterproof material, ...

Energy conserving apparatus for regulating temperature of monitored device

With reference now to the drawing figure, the apparatus of the present invention for controlling ...

Heat dissipating circuit board assembly

Details

Inventors: Wigley, Patrick A.;
Assignee: CPS, Inc. (Sunnyvale, CA)
Primary Examiner: Tolin; Gerald P.
Assistant Examiner:
Attorney, Agent or Firm: Flehr, Hohbach, Test

An overall circuit board assembly is disclosed herein and includes specifically a printed circuit and board in an actual working embodiment which is comprised of a plurality of interconnected electronic components supported in circuit on one side of a support substrate and which is especially suitable for use with circuitry operated at a relatively high voltage-to-ground level. This assembly also includes an arrangement which dissipates heat generated by these electronic components for maintaining the printed circuit board relatively cool.

DETAILED DESCRIPTION One object of the present invention is to provide an overall circuit board assembly including a circuit board, specifically a printed circuit board, which is especially suitable for operation at relatively high voltages or, in any event, at high voltage-to-ground levels.
Another object of the present invention is to provide an overall circuit board assembly including heat dissipating structure which is uncomplicated in design, economical to produce and reliable in use.
Still another object of the present invention is to utilize grounded electrically conductive heat dissipating block, specifically aluminum in a preferred embodiment, as part of the overall dissipating strucute for more efficiently transferring heat from the circuit board to a remote location.
Yet another object of the present invention is to provide voltage standoff between the circuit board circuitry and the electrically conductive heat dissipating block sufficient to prevent the block from grounding the circuitry and disrupting operation thereof.
A further object of the present invention is to provide an uncomplicated, economical and reliable method of dissipating heat from a circuit board, specifically a printed circuit board, in a structural way.
Still a further object of the present invention is to efficiently dissipate heat from the printed circuit board without disrupting the operation of its circuitry.
As will be seen hereinafter, the overall circuit board assembly disclosed herein may include a conventional printed circuit board including a plurality of electronic components interconnected in circuit with one another in a predetermined way, and a substrate for physically supporting these components.
Moreover, in accordance with the present invention, the overall assembly also includes thermally conductive heat dissipating structure and thermally conductive and electrically non-conductive heat transfer structure which together operate to transfer heat away from the circuit board.
The heat dissipating structure is spaced from the electronic components and is adapted for connection with an otherwise separate thermally conductive frame for dissipating heat thereto

Related patents

	Detection of catastrophic failure of dielectric, improper connection, and temperature of a printed circuit assembly via one wire The present invention allows the detection of the catastrophic failure of the dielectric within a multilayer printed circuit assembly. Such detection requires one wire, ...
	Fluid-cooled integrated circuit package The present invention is directed to a low profile package for high density integrated circuits with liquid cooling for the efficient removal of waste heat caused by ...
	Temperature monitoring system for air-cooled electric components The present invention is directed to a method and apparatus for direct measurement of temperature and pressure for integrated circuit boards. According to the present ...
	Multiple ply bag with detachable inner seal pouch for packaging products The invention solves the foregoing problems in multiwall bag constructions and methods of making them by providing an inner plastic bag that is as long as the outer ...
	Character processing device adapted to perform document-editing processing and typewriting processing It is an object of the present invention to solve the problems of the prior art. It is another object of the present invention to provide an information and character ...
	Electronic bin temperature monitor Referring now more specifically to the drawings, FIG. 1 shows an elevational view of a grain storage bin 10. Attached to the bin 10 is a control and readout panel 12 ...
	Multi-driver integrated circuit What is claimed is: 1. In a monolithic integrated circuit (IC) in which "N" driver power circuits are formed; where "N" is an integer greater than 2; with each one of ...
	Cylindrical alarm-functioned accessory device for intravenous infusion procedure I claim: 1. A cylindrical alarm-functioned accessory device for intravenous infusion procedure comprising: a cylindrical body having an upper and a lower flange arranged ...
	Vehicle air and electrical connector OF THE PREFERRED EMBODIMENT As best shown in FIG. 1 the coupling comprises a trailer cupped section 10 and a vehicle cupped section 12. The trailer section is adapted ...
	Packaged integrated circuit including heat slug having an exposed surface in accordance with the invention, there is provided an integrated circuit or circuits, or hybrid circuit or circuits, in a low cost plastic encapsulated package having ...

0.014
Archive: All patents - Links Copyright (c)2006 Eipa-patents.org - All rights reserved