Leadless capacitors

DETAILED DESCRIPTION We claim: 1.
A method of making lead-less solid electrolytic capacitor comprising: providing a lead frame of thin metal having, at each location along its length, an anode connection terminal having a bent-up part and connected to the lead frame by at least one neck located intermediate the ends of the terminal, and a cathode connection terminal connected to the lead frame by at least one neck located intermediate the ends of the terminal; providing a solid electrolytic capacitor body with an anode wire projecting therefrom and a cathode connection area on the body; welding the anode wire to the bent-up part and connecting the cathode connection area to the cathode connection terminal; employing a mould having two mould halves brought up against opposite sides of the lead frame defining a moulding cavity around the body and the connection terminals to encapsulate the body, the anode wire and portions of the anode and cathode connection terminal adjacent the body; and separating the encapsulated body from the lead frame by severing at least one of the connection webs.
2.
A method of making a solid electrolytic leadless capacitor comprising: providing a lead frame of thin metal having, at each of a plurality of locations, anode and cathode connection terminals; bending up a part of the anode connection terminal to provide a welding edge; providing a solid electrolytic capacitor body, the body having a cathode connection area at one end and an anode wire projecting from the opposite end; locating the body on the terminals and connecting the cathode connection area to the cathode connection terminal and welding the anode wire to an edge of the bent up part; applying a mould to the lead frame to define for each capacitor a mould cavity; moulding an insulating material around the capacitor body; removing the mould to provide an encapsulated capacitor with surfaces of the terminals exposed; and removing the encapsulated capacitors from the lead frame.
3.
A method as claimed in claim 2, wherein the mould comprises a lower part applied to the underside of the lead frame and an upper part applied to the top of the lead frame and with the lead frame sandwiched between the two parts