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Method for sealing an ultracapacitor, and related articles
| Details |
Inventors: Day, James; Shapiro, Andrew Philip; Jerabek, Elihu Calvin;
Assignee: General Electric Company (Schenectady, NY)
Primary Examiner: Lorin; Francis J.
Assistant Examiner:
Attorney, Agent or Firm: Brown; S. Bruce, Johnson; Noreen C.
An improved process for sealing at least one ultracapacitor which includes a multi-layer structure is disclosed. The process includes the step of applying a substantial vacuum to press together an uppermost layer of the structure and a lowermost layer of the structure and to evacuate ambient gasses, wherein a sealant situated in a peripheral area between the facing surfaces of the layers forms a liquid-impermeable seal for the structure under the vacuum. In some embodiments, a press is used to apply pressure to the peripheral area on which the sealant is disposed. Usually, the ultracapacitor would be situated within an enclosable region of the press, and a collapsible membrane would be fastened over the ultracapacitor to fully enclose the region and transmit the vacuum force to the multi-layer structure. The force applied by the press itself causes the sealant to flow, thereby ensuring a complete seal upon curing of the sealant. This process can be employed to seal one ultracapacitor or a stack of at least two ultracapacitors. Another embodiment of this invention is directed to an apparatus for sealing a multi-layer ultracapacitor, comprising the elements described above. |
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DETAILED DESCRIPTION In response to the needs discussed above, the present inventors have discovered an improved process for sealing at least one ultracapacitor which includes a multi-layer structure.
The process comprises the following steps: (a) applying a substantial vacuum to press together an uppermost layer of the structure and a lowermost layer of the structure, and to evacuate any ambient gasses (e.
g.
, air or an inert gas, depending on the environment in which the ultracapacitor is manufactured) from the internal region of the structure, wherein a sealant situated in a peripheral area between the facing surfaces of the uppermost layer and the lowermost layer forms a liquid-tight seal for the structure under the vacuum; and then (b) releasing the vacuum.
The uppermost layer and the lowermost layer of the ultracapacitor are usually conductive layers.
In preferred embodiments, a press is used to apply pressure to the peripheral area on which the sealant is disposed.
Usually, the ultracapacitor would be situated within or upon an enclosable region of the press (e.
g.
, within a recess), and a collapsible membrane would be fastened over the ultracapacitor to fully enclose the region and transmit the vacuum force to the multi-layer structure.
The force applied by the press itself causes the sealant to flow, thereby ensuring a complete seal upon curing of the sealant.
Moreover, a heating mechanism can optionally be utilized to enhance the flow of the sealant while the multi-layer stack is being compressed.
This process can be employed to seal one ultracapacitor or a stack of at least two ultracapacitors.
Moreover, the invention can be used for many different types of ultracapacitors, such as the standard, single-cell type, or a bipolar ultracapacitor.
Ultracapacitors sealed using the invention contain, at most, only very small amounts of undesirable gasses such as oxygen.
Moreover, they are highly resistant to leakage of the electrolyte, and are very amenable to the pressures used in subsequent process steps, such as stack formation
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