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| Synthetic turf game surface |
| FIG. 1 schematically illustrates a fragment of a synthetic turf pile carpet 10. The carpet has ... |
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Module substrate and method of producing the same
| Details |
Inventors: Okada, Masanobu; Koide, Tomoyuki; Nakaya, Kazuyoshi; Nakaji, Hiroyuki;
Assignee: Murata Manufacturing Co., Ltd. (Kyoto, JP)
Primary Examiner: Talbott; David L.
Assistant Examiner: Patel; B
Attorney, Agent or Firm: Keating & Bennett, LLP
End-face through holes each comprising a concave-curved end-face opening groove and an end-face electrode covering the inner wall of the groove are formed in the end-faces of a substrate. Furthermore, a solder having a semi-circular shape is attached to the end-face electrode. The solder comprises an electrode facing portion facing the end-face electrode in the end-face groove, and a protuberant portion elongated from the electrode facing portion to protrude on the back-surface side of the substrate. Thereby, even if the substrate or the like is warped, a gap between the end-face electrode and the electrode pad of a mother board can be filled with the protuberant portion of the solder to connect the end-face electrode and the electrode pad to each other. |
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DETAILED DESCRIPTION Accordingly, it is an object of the present invention to provide a module substrate of which the end-face electrodes can be securely connected to a mother board even if warpage occurs in the substrate or the like, and a method of producing the same.
To achieve the above object, according to the present invention, there is provided a module substrate which comprises a substrate for mounting an electronic component on the front surface side thereof, and end-face electrodes provided in the end-faces defining the outer peripheral edge of the substrate and adapted to be connected to the electronic component.
The end-face electrodes are each provided with a solder to be connected to a mother board provided on the back surface side of the substrate, and the solder is protruded on the back surface side of the substrate.
In the above-described configuration, even if warpage occurs in the substrate, causing a gap between the end-face electrodes of the substrate and the electrode pads of the mother board, the tips of the solders protruding on the back surface side of the substrate securely contact with the electrode pads of the mother board.
Accordingly, in this state by melting the solder, the end-face electrodes and the electrode pads are connected to each other, and fillets can be formed between the end-face electrodes and the electrode pads.
Preferably, said substrate is provided with end-face opening grooves each opening at the end-faces of the substrate, said end-face electrodes are provided on the inner walls of the end-face opening grooves, respectively, and said solders each including an electrode facing portion facing the end-face electrode and being disposed in the end-face opening groove, and an protuberant portion provided so as to protrude from the electrode facing portion to the back-surface side of the substrate.
Thus, with the electrode facing portions, the solders can be attached to the end-face electrodes in the end-face opening grooves.
With the protuberant portions, the solders can be contacted with the electrode pads of the mother board
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