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Temperature measuring apparatus
In the FIGURE, a positive power supply terminal 10 supplies power to a differential amplifier 12 and to a constant current generator generally designated as 14. A ...
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Heat pipe cooling for semiconductor device packaging system
This invention improves the prior art by the provision of a cooling frame or supporting carrier for a plurality of the heat pipes attached thereto and spanning the space ...
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Heat dissipating circuit board assembly
One object of the present invention is to provide an overall circuit board assembly including a circuit board, specifically a printed circuit board, which is especially ...
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Detection of catastrophic failure of dielectric, improper connection, and temperature of a printed circuit assembly via one wire
The present invention allows the detection of the catastrophic failure of the dielectric within a multilayer printed circuit assembly. Such detection requires one wire, ...
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Fluid-cooled integrated circuit package
The present invention is directed to a low profile package for high density integrated circuits with liquid cooling for the efficient removal of waste heat caused by ...
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Temperature monitoring system for air-cooled electric components
The present invention is directed to a method and apparatus for direct measurement of temperature and pressure for integrated circuit boards. According to the present ...
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Multiple ply bag with detachable inner seal pouch for packaging products
The invention solves the foregoing problems in multiwall bag constructions and methods of making them by providing an inner plastic bag that is as long as the outer ...
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Character processing device adapted to perform document-editing processing and typewriting processing
It is an object of the present invention to solve the problems of the prior art. It is another object of the present invention to provide an information and character ...
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Electronic bin temperature monitor
Referring now more specifically to the drawings, FIG. 1 shows an elevational view of a grain storage bin 10. Attached to the bin 10 is a control and readout panel 12 ...
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Multi-driver integrated circuit
What is claimed is: 1. In a monolithic integrated circuit (IC) in which "N" driver power circuits are formed; where "N" is an integer greater than 2; with each one of ...
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