 Process for the production of a honeycomb core from foil strip utilizing a position detector |
| Thus, the invention is based upon the task of creating a process for the production of a honeycomb ... |
|
| Waist elastic applicator for diaper or similar article |
| The present invention is an apparatus for applying tensioned elastic transversely to a moving web ... |
|
| Manufacture of internally reinforced boxes |
| The invention provides a process and machine for forming Bliss boxes with internal reinforcing and ... |
|
| Bi-metallic thermo-barrier material and method of welding |
| The invention comprises a multilayer cellular core material constructed of titanium alloys, inconel,... |
|
| Multi-ply heat-insulating material |
| What is claimed is: 1. Multi-ply heat-insulating structure of which one side is exposed to heat, ... |
|
| Insulated barbeque unit |
| The present invention utilizes a pair of half cylinders which are hinged along one of their edges ... |
|
| Sheet type composite material and method and apparatus for manufacturing the same |
| I claim: 1. A process for making a sheet type composite material characterized by the steps of ... |
|
| Thermal insulating mat |
| I claim: 1. A thermal insulating mat comprising a plurality of sealed chambers filled with a filler ... |
|
| Catalytic reactor arrangement including catalytic reactor matrix |
| OF THE DRAWINGS FIGS. 1 through 4 show possible folding patterns for forming a matrix for a ... |
|
|
Multilayer circuit board and a method for fabricating the same
| Details |
Inventors: Mizutani, Daisuke; Yokouchi, Kishio;
Assignee: Fujitsu Limited (Kanagawa, JP)
Primary Examiner: Nimmo; Morris H.
Assistant Examiner: Figlin; Cheryl R.
Attorney, Agent or Firm: Armstrong, Westerman, Hattori, McLeland & Naughton
An interlayer connection wiring penetrating each of resin films constituting a multilayer circuit board and a surface wiring connected to the interlayer connection wiring are formed in predetermined positions on surfaces of each resin film. The resin films are laminated while being positioned so that the interlayer connection wiring of one of each adjacent pair of the circuit bases is superposed on a part of the surface wiring of the other, and are thereafter treated under a high-temperature and high-pressure condition to be combined with each other. If a resin film formed of a thermoplastic resin is adopted, the laminated resin films are combined by intermixing the interfaces of each adjacent pair of resin films. As the resin films shrink when the laminated resin films is cooled to ordinary temperature, a compressive force is applied to the contact surfaces of the interlayer connection wiring and the surface wiring. A resin block in which metal wires disposed parallel to each other are embedded is sliced perpendicularly to the metal wires to form resin films each having interlayer connection wiring elements with projections formed on opposite end portions of each wiring element. The projections are utilized to ensure reliable connections between the interlayer connection wiring of one of each adjacent pair of resin films and the surface wiring formed on the other. |
|
DETAILED DESCRIPTION It is therefore an object of the present invention to provide a means for reducing the time taken to fabricate a multilayer circuit board formed of resin films.
Another object of the present invention is to provide a means for improving the reliability of interlayer connection of wiring in a multilayer circuit board formed of resin films.
According to the present invention, there is provided a method of fabricating a multilayer circuit board, comprising the steps of making a plurality of circuit bases each having a layer-insulation film formed of a resin, an interlayer connection wiring penetrating the layer insulation film, and a surface wiring connected to the interlayer connection wiring and extending on a surface of the layer-insulation film, laminating the plurality of circuit bases while positioning the same so that the interlayer connection wiring of one of each adjacent pair of the circuit bases is superposed on a part of the surface wiring of the other of the adjacent pair of the circuit bases, and treating the plurality of laminated circuit bases at a predetermined temperature and a predetermined pressure to combine the circuit bases.
According to this fabrication method, the circuit bases to be laminated can be fabricated concurrently with respect to the positions of their respective interlayer connection wiring elements and patterns of the surface wiring connected to the interlayer connection wiring elements.
Accordingly, the number of days for fabricating the multilayer circuit board is the sum of the number of days required to form the circuit bases and the number of days required to combine the circuit bases in a superposed state, which can be much smaller than fifteen, the number of days required by the conventional art.
Further, since the process of making each circuit base includes no steps for applying a resin precursor and curing the same, such as step (b) of the conventional fabrication method, the number of days required to make the circuit boards can be reduced from three, the number of days required by the conventional method, to two or less
|
| Related patents |
|
|
Ceramic circuit board
I claim: 1. A ceramic circuit board, which comprises a ceramic substrate and a metal circuit plate bonded to each other through a silver-copper-based brazing material ...
|
|
|
Printed circuit board
OF THE INVENTION This invention will be described by referring to the following illustrative examples and attached figures. EXAMPLE 1 FIG. 1 is a cross-sectional view ...
|
|
|
Method for manufacturing a multilayer printed circuit board
U.S. Pat. No. 3,998,601 discloses a composite foil and a method for manufacturing the latter. The composite foil comprises an electrodeposited copper support layer and a ...
|
|
|
Cylindrical linear motor having individually toothed laminated primary cores
Accordingly, it is an object of the present invention to provide a cylindrical linear motor which overcomes the aforementioned problems encountered in the conventional ...
|
|
|
Rotor for a synchronous reluctance machine
It is, therefore, an object of the present invention to provide an improved rotor for a synchronous reluctance machine that secures the rotor sections to the shaft at ...
|
|
|
Stator structure of reciprocating motor
Therefore, an object of the present invention is to provide a stator structure of a reciprocating motor, which is capable of simplifying the processing and the ...
|
|
|
Reciprocating motor
Therefore, an object of the present invention is to provide a reciprocating motor which is able to ensure and to be compacted since an outer stator or an inner stator ...
|
|
|
Method and apparatus for mode selection for high voltage integrated circuits
Disclosed is a method to select alternative functional modes of operation of an integrated circuit through a terminal that can withstand a high maximum voltage. In one ...
|
|
|
Layered self-regulating heating article
OF THE INVENTION From the foregoing discussion it is apparent that by utilizing the teaching of the present invention thermoplastic polymer compositions having PTC ...
|
|
|
Contact assembly
In accordance with one embodiment of the present invention, a contact apparatus is provided to facilitate high contact densities, while minimizing crosstalk and ...
|
|
|
Metal Working 
