Pin grid array package

DETAILED DESCRIPTION It is an object of this invention to provide a low ohmic resistance and low cost pin grid array package which can be manufactured efficiently without contaminating the environment.
A further object of this invention is to provide a pin grid array package having a palladium-silver layer applied to an upper surface of a substrate and a silver layer applied to the palladium-silver layer in order to provide a low ohmic resistance circuitry for improved signal transmission.
Gold plated copper pins and the palladium-silver thick film metalization are connected by spot welding to form the gold/copper/silver alloy at very high temperature.
This alloy can resist high temperature treatment in the follows on processing.
Another object of this invention is to provide a multi-layered pin grid array package which can be processed in normal atmospheric environment so as to reduce manufacturing costs.
Yet a further object of this invention is to provide a pin grid array package which utilizes ceramics formed by a dry-molding method using a dry powder mixed with solvent type binders.
This process demands lower costs and will not contaminate or pollute the environment.
These and additional objects, if not set forth specifically herein, will be readily apparent to those skilled in the art from the detailed description provided hereinbelow, with appropriate reference to the accompanying drawings.