Printed circuit board fabrication

DETAILED DESCRIPTION It is an object of the present invention to provide a lamination that will eliminate most if not all of the above-mentioned problems.
It is a further object of this invention to reduce the need for inspections, to upgrade the mechanical and electrical performance, to reduce the fabricating cost of circuit boards and to increase the useful life of a completely assembled board.
Briefly, the design of the present invention takes into account that the leads of the components, are spaced at a standard pitch "t," usually either 0.
100 or 0.
050 inches.
The fibers are arranged in the laminate so as to provide "fiber free" spots spaced at the standard pitch.
Consequently, a number of mounting holes at needed locations can be drilled (or punched) without cutting any of the reinforcing fibers.
There are several suitable manufacturing approaches to control the fiber locations to achieve this goal.
The present invention also offers the possibility of fabricating holes in a shape that differs from round.
Since the punching does not require the cutting of reinforcing fibers, the punching pressure is lower and a rectangular punch is sufficiently strong to produce the holes in the laminate.
The present invention utilizes most of the presently available processes and equipment while achieving the advantages offered by the invention.