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Metal Working

Process-for-producing-printed-wiring-board

Top dressed plating surface with resilient underpad

OF THE PREFERRED EMBODIMENTS The drawing figure comprises a sectional view through a playing ...

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Referring to the drawings, the playing field surface 10 comprises a stabilized base or support ...

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OF PREFERRED EMBODIMENTS With reference to FIG. 1, the invention relates to a synthetic grass turf ...

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FIG. 1 schematically illustrates a fragment of a synthetic turf pile carpet 10. The carpet has ...

Method of making a ceramic capacitor

Accordingly, a principal object of the present invention is to provide a ceramic capacitor which ...

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Therefore it is the object of the invention to improve a drift chamber of the kind mentioned above ...

Miniaturized ion mobility spectrometer sensor cell

To accomplish the above and other objectives, the present invention provides for an improved ion ...

Process for producing printed wiring board

Details

Inventors: Homma, Masaji; Yamauchi, Hitoshi;
Assignee: Hitachi Condenser Co., Ltd. (Tokyo, JP)
Primary Examiner: Kittle; John E.
Assistant Examiner: Ryan; P. J.
Attorney, Agent or Firm: Antonelli, Terry & Wands

A base board having a plurality of semicircular through-holes filled with solder at side walls produced by filling through-holes with solder can be connected electrically to printed circuit boards with large connecting strength and high reliability.

DETAILED DESCRIPTION It is an object of this invention to provide a process for producing a base board with a special structure overcoming the defects of the prior art technique.
This invention provides a process for producing a base board which comprises: forming through-holes in the predetermined portions in a base sheet, filling solder in the through-holes, and cutting the base sheet so as to give a plurality of base boards having semicircular through-holes filled with solder at side walls.

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