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Home Metal Working Radio-frequency-coil-for-use-in-an-ionized-physical-vapor-deposition-apparatus

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Details
Inventors: Rossnagel, Stephen Mark; Restaino, Darryl D.; Simon, Andrew Herbert; Smetana, Pavel;
Assignee: International Business Machines Corporation (Armonk, NY)
Primary Examiner: Diamond; Alan
Assistant Examiner:
Attorney, Agent or Firm: Anderson; Jay H.

A cooling structure and a reinforcing structure are described for use with a radio-frequency coil in an ionized physical vapor deposition apparatus. The cooling structure includes a portion for carrying coolant and is proximate to the RF coil along the outer circumference thereof. The cooling structure is shaped relative to the RF coil so that thermal expansion of the RF coil brings the RF coil into close contact with the cooling structure, thereby facilitating heat transfer from the RF coil to the coolant. The reinforcing structure is similarly shaped, and may be integrated with the cooling structure. In addition, the RF coil or cooling/reinforcing structure may be mounted to the wall of the process chamber with telescoping mounting posts, which permit the RF coil to maintain its shape while undergoing thermal expansion. The parasitic inductance of the RF coil leads is reduced by arranging those leads coaxially, thereby minimizing power losses in the RF coil.

DETAILED DESCRIPTION The present invention addresses the above-described need by providing a cooling structure and/or a reinforcing structure for an RF coil in which deformation of the RF coil due to thermal expansion is reduced or avoided.
In accordance with a first aspect of the present invention, a cooling structure including a portion for carrying coolant is provided for the RF coil; the cooling structure is proximate to the RF coil along the outer circumference thereof.
The cooling structure is at a lower temperature than the RF coil, and may have thermal expansion properties different from those of the RF coil.
Furthermore, the cooling structure is shaped relative to the RF coil so that thermal expansion of the RF coil causes the RF coil to be in close contact with the cooling structure, thereby facilitating heat transfer from the RF coil to the coolant.
The RF coil also may be demountable from the cooling structure.
The cooling structure is shielded by the RF coil from sputtering during the IPVD process.
In accordance with a second aspect of the invention, a reinforcing structure is provided which gives mechanical reinforcement for the RF coil.
The reinforcing structure is proximate to the RF coil along the outer circumference thereof.
The reinforcing structure and the RF coil are of materials having different thermal expansion properties and are shaped so that thermal expansion of the RF coil causes the RF coil to be in close contact with the reinforcing structure.
Furthermore, the cooling structure may be shaped to provide mechanical reinforcement for the RF coil, so that the cooling structure and the reinforcing structure are integrated.
In accordance with another aspect of the invention, the RF coil (or cooling or reinforcing structure) is mounted on a fixed portion of the IPVD device by a mounting post having a first portion and a second portion slidably connected thereto.
This arrangement permits the mounting post to telescope in accordance with thermal expansion of the RF coil



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