Heat sink mounting
What is claimed: 1. In combination: (a) a heat sink including a substantially flat base portion; and (b) at least one mounting stud comprising an elongated shaft with a radially enlarged portion exten... Read More
Inventors: Jordan, William D.; Hundt, Roger C.; Pritchett, James D.;, Assignee: Thermalloy, Inc. (Dallas, TX) |
Terminal-carrying circuit board
A main object of the present invention is, therefore, to provide a method which is capable of performing the mounting of the lead terminals to the circuit board without using any soldering flux, while... Read More
Inventors: Kubo, Masao; Kamada, Kazuo; Ogasawara, Masanobu; Nakamura, Yoshimitsu;, Assignee: Matsushita Electric Works, Ltd. (Osaka, JP) |
Molded electrical connector
Accordingly, an object of the present invention is to reduce the size of the molded connector. According to a broad aspect of the invention, there is provided a molded connector to be mounted on a dev... Read More
Inventors: Miyazaki, Sho;, Assignee: Autonetworks Technologies, Ltd. (Nagoya, JP); Sumitomo Wiring Systems, Ltd. (Yokkaichi, JP); Sumitomo Electric Industries, Ltd. (Osaka, JP) |
Transceiver mounting assembly having integrally formed lock
It is accordingly an object of the present invention to provide a mounting assembly for a transceiver which permits the transceiver to be quickly and easily mounted and dismounted therefrom. It is a f... Read More
Inventors: Repplinger, Daniel J.; Kay, Brian D.; Weiss, Gary R.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Solder paste stencil printer
OF THE INVENTION Refering to FIG. 1, the subject printed circuit assembly to be worked upon is placed conveniently on the work plate 1. It is only required that the area to be stencilled be within th... Read More
Inventors: Omori, Michael K.; Miller, Floyd G.;, Assignee: |
Microelectronic connector for engaging bump leads
The present invention addresses these needs. One aspect of the present invention provides a sheet socket component for mounting a microelectronic element such as a semi-conductor chip or other element... Read More
Inventors: Fjelstad, Joseph; Smith, John W.; DiStefano, Thomas H.; Walton, A. Christian;, Assignee: Tessera, Inc. (San Jose, CA) |
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
The object of the present invention is to provide a method for easily fabricating solder bumps having a desired size. The other object of the present invention is to provide a method for fabricating s... Read More
Inventors: Ochiai, Masayuki; Ueda, Hidefumi; Sono, Michio; Yamaguchi, Ichiro; Mitobe, Kazuhiko; Otake, Koki; Kasai, Junichi; Kamehara, Nobuo; Yamagishi, Yasuo; Mizukoshi, Masataka;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Screen printing method and screen printing apparatus
OF THE INVENTION Before the description of the present invention proceeds, it is to be noted that like parts are designated by like reference numerals throughout the accompanying drawings. A screen p... Read More
Inventors: Wachi, Akihiko; Yanachi, Seishiro; Kakishima, Nobuyuki; Matsumoto, Masaya;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Method of forming a solder ball
The present invention is drawn to a method of making solder bump interconnections ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit... Read More
Inventors: Hembree, David R.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Method for fabricating via holes in a semiconductor wafer
Illustrated in FIG. 1 is a substrate 10 having first and second opposing surfaces 12 and 14 which will hereinafter be referred to as the front side and back side respectively. Although the substrate ... Read More
Inventors: Subbarao, Saligrama N.; Huang, Ho-Chung;, Assignee: RCA Corporation (New York, NY) |
Reverse laser drilling
What is claimed is: 1. A method for reverse laser drilling comprising the steps of: (a) providing a body of material and laser beam means which emits a laser beam of a frequency such that said body of... Read More
Inventors: Anthony, Thomas R.;, Assignee: General Electric Company (Schenectady, NY) |
Insulating glass body with electrical feedthroughs and method of preparation
What is claimed is: 1. A body of electrically insulating glass having opposed, spaced major surfaces and at least one bore extending completely therethrough interconnecting said major surface, said bo... Read More
Inventors: Anthony, Thomas R.;, Assignee: General Electric Company (Schenectady, NY) |
Multilayer circuit board manufacturing
In accordance with a preferred embodiment of the invention, a circuit board is fabricated from a board comprising a core layer, an inner conductor run layer overlying the core layer on one side thereo... Read More
Inventors: Burgess, Larry W.;, Assignee: Interconnect Technology Inc. (Beaverton, OR) |
Process for producing ultra-fine ceramic particles
Accordingly, it is the primary object of the present invention to provide a process for producing ultra-fine ceramic particles, which can overcome above-mentioned disadvantages. It is a further object... Read More
Inventors: Ota, Kazuhide; Abe, Susumu;, Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota, JP) |
Method for forming through holes in a polyimide substrate
The electrical interconnections, between conductor layers in electronic components which are fabricated from a dielectric substrate composed of a polyimide polymer and a conductor layer, usually copp... Read More
Inventors: Lantzer, Thomas D.;, Assignee: E. I. Du Pont de Nemours and Company (Wilmington, DE) |
Method for applying mold release coating to separator plates for molding printed circuit boards
There has accordingly been found to remain a need for improved processes for molding printed circuit board laminates and more particulary for providing separator mold plates capable of being used repe... Read More
Inventors: Dagostino, John J.; Lucas, Gregory L.;, Assignee: Zycon Corporation (Santa Clara, CA) |
Method of making rigid-flex printed circuit boards
There has accordingly been found to remain a need for an improved rigid-flex printed circuit board product and method of fabrication. It is thus an object of the present invention to provide an improv... Read More
Inventors: Lucas, Gregory L.; Bryan, Scott K.;, Assignee: Zycon Corporation (Santa Clara, CA) |
Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
Accordingly, it is an object of the present invention to provide an effective capacitor laminate for use in capacitive printed circuit boards of the type described above in order to meet design parame... Read More
Inventors: Howard, James R.; Lucas, Gregory L.;, Assignee: Zycon Corporation (Santa Clara, CA) |
Method for producing multilayer printed wiring boards
Accordingly, an object of the present invention is to provide a method for producing a multilayer printed wiring board which can eliminate the foregoing problems associated with the conventional techn... Read More
Inventors: Furui, Seiji; Maniwa, Ryo; Ishido, Kiminori; Okada, Keisuke;, Assignee: NEC Corporation (Tokyo, JP) |
Ceramic substrate having wiring of silver series
What is claimed is: 1. A ceramic substrate comprising: a ceramic body having a major face and consisting essentially of alumina and glass; silver particles having a 1 to 5 .mu.m diameter and being dis... Read More
Inventors: Kata, Keiichiro; Shimada, Yuzo;, Assignee: NEC Corporation (JP) |
Annular resistor coupled with printed circuit board through-hole
It is accordingly an object of the present invention to provide an improved design for PCBs and the like including resistor elements of simplified design with reduced surface requirements on the PCBs.... Read More
Inventors: Howard, James R.; Lucas, Gregory L.; Bryan, Scott K.; Choe, Jin S.;, Assignee: Zycon Corporation (Santa Clara, CA) |
Clock start up stabilization for computer systems
Apparatus and methods in accordance with the present invention resolve the skew problem associated with the initially generated clock pulses by figuratively swallowing a predetermined number of the in... Read More
Inventors: Hanson, David A.; Priest, Edward C.;, Assignee: Cray Research, Inc. (Chippewa Falls, WI) |
Manufacturing method for a multilayer wiring board
It is accordingly an object of the present invention to provide a novel multilayer wiring board which can secure electrical connection between circuit patterns formed in different layers by designing ... Read More
Inventors: Tamura, Toshio; Yasuda, Nobuyuki;, Assignee: Sony Corporation (Tokyo, JP) |
Area array interconnect device and method of manufacture thereof
The present invention addresses the problems discussed above in a new and improved interconnect device and method of manufacture thereof. The present invention will be described primarily in the conte... Read More
Inventors: Nelson, Gregory H.; Lockard, Steven C.;, Assignee: Rogers Corporation (Rogers, CT) |
Printed circuit board having a land with an inwardly facing surface and method for manufacturing same
The problems outlined above are in large part solved by an improved land configuration which allows for channeling of a respective lead to the center of the land during placement, and further channeli... Read More
Inventors: Swamy, N. Deepak;, Assignee: Dell USA, L.P. (Austin, TX) |
Multilayer wiring structure for attaining high-speed signal propagation
The present invention has been developed in consideration of the above circumstances. In other words, the object of the present invention is to provide a multilayer wiring structure which is optimum f... Read More
Inventors: Hirano, Naohiko;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Electronic scale system with programmable function keys
FIG. 1 illustrates electronic scale system 10 embodying the principles of the invention. System 10 may be used in a mailroom or shipping room of a business establishment to accurately weigh and rate ... Read More
Inventors: Schwartz, Robert G.; Crowe, Allen A.; Emmett, James S.; Eskandari, Fetneh; Palange, Martin F.; Simcik, Mark E.; Swanbery, Robert; Japenga, Robert J.; Lehman, Joseph L.; Weirsman, William A.; Rahgo, George P.;, Assignee: Ascom Hasler Mailing Systems, Inc. (Shelton, CT) |
Plated plastic castellated interconnect for electrical components
This invention provides a plated plastic castellated interconnect for use in the surface connection of electrical components. The interconnect includes a first electrical component comprising a substr... Read More
Inventors: Patterson, Timothy P.; Hoge, Carl E.; Baia, Joseph;, Assignee: Western Digital Corporation (Irvine, CA) |
High pressure header for a semiconductor pressure transducer
The present invention solves these and other needs by providing a header structure for a semiconductor pressure transducer having all of the terminal pins embedded in a unitary cylindrical glass membe... Read More
Inventors: Bodin, Joel J.;, Assignee: Honeywell Inc. (Morristown, NJ) |
Low profile electronic enclosure
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. A sealed enclosure comprising a cover and a base member that fits inside the cover; a... Read More
Inventors: Launtz, Jack E.;, Assignee: Legacy Technologies, Inc. (Kane, PA) |
Metal Working 
