Hermetic glass encapsulation for semiconductor die and method
The present invention pertains to a hermetically sealed semiconductor die and method of sealing wherein only the active surface and lead contact areas are encapsulated with glass and leads are bonded ... Read More
Inventors: Welling, John R.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Package for an integrated circuit having a container with support bars
It is an object of the present invention to provide an integrated circuit package which may be formed expediently into a thin high density structure. These and other objects and features of the presen... Read More
Inventors: Shirasaki, Yuzo;, Assignee: Citizen Watch Co., Ltd. (Tokyo, JP) |
Sealing cover for an hermetically sealed container
OF THE PREFERRED EMBODIMENT As used herein, the term "solder" refers to any metal or metallic alloy used to join metallic surfaces by fusion of the metal alloy between the surfaces and subsequent coo... Read More
Inventors: Geschwind, Gary I.;, Assignee: Raychem Corporation (Menlo Park, CA) |
Equipment box for a power converter arrangement
I claim: 1. An equipment box for a power converter unit, comprising, a rear wall, side walls and a front wall, said rear wall having vertical cooling ribs on the outside thereof and a planar mounting ... Read More
Inventors: Lehmann, Kjeld;, Assignee: Danfoss A/S (Nordborg, DK) |
Printed circuit board mounting for communication termination
Accordingly, an object of the present invention is to provide a printed circuit board structure which carries it own termination connectors usable to connect the board to the customer's equipment and ... Read More
Inventors: Duthie, George A.; Frey, Mark C.; Gleadall, Wilfred L.; Skrovanek, Ambroz C.; Corp, David O.;, Assignee: Hubbell Incorporated (Orange, CT) |
Electrical connections with controlled thermal and electrical resistances
More specifically the invention relates to a flat, thermally and electrically insulating support, which can be flexible, rigid or zonally rigid as a function of the particular case. It is advantageous... Read More
Inventors: Massit, Claude; Nicolas, Gerard;, Assignee: Commissariat a l'Energie Atomique (Paris, FR) |
Flat cable wire-connector
What is claimed is as follows: 1. A wire-connector for making solderless connection to wires of a compact flat cable, comprising a contact element having a flat metal plate body having parallel closel... Read More
Inventors: Wedekind, Albert D.; Benzer, John W.;, Assignee: Minnesota Mining and Manufacturing Company (St. Paul, MN) |
Pinking shears
The present invention provides a pinking shears having a non-metallic spacer and integral pressure producing ridge member located between the blades. The member has a spacer portion located between an... Read More
Inventors: Zaitz, Allen J.;, Assignee: Oy Fiskars AB (Helsinki, FI) |
Expanding surface mount compatible retainer post
In accordance with the invention, a novel retainer post is provided that is suitable for holding an electrical component, such as a chip carrier, header or other electrical, electronic or like device,... Read More
Inventors: Ignasiak, Martin C.;, Assignee: Minnesota Mining and Manufacturing Company (St. Paul, MN) |
All metal flat package
I claim: 1. The method of manufacturing a flat package for electric microcircuits comprising: glass-sealing electrical leads in apertures in a Kovar frame, and thereafter brazing said frame at a tempe... Read More
Inventors: Scherer, Jeremy D.;, Assignee: Isotronics, Incorporated (New Bedford, MA) |
Electrical universal connecting box
I claim: 1. An electrical connecting box for low voltage installations comprising a lower part (1) having a bottom (2) to be arranged against a fixed support and an upper part (8) adapted for securing... Read More
Inventors: Nielsen, Alf;, Assignee: |
Structure and technique for achieving reduced inductive effect of undesired components of common lead inductance in a semiconductive RF power package
It is an object of the invention to provide an improved RF power hybrid transistor device, or package, embodying improved reductions in the common lead inductance. It is a further object of the invent... Read More
Inventors: Yester, Jr., Francis R.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Method of making a take-carrier for manufacturing IC elements
It is an object of the present invention to provide a method of making a tape-carrier for manufacturing IC elements, in which the IC chip which has no bumps thereon can be bonded to lead terminals by ... Read More
Inventors: Tabuchi, Seiichi; Wakabayashi, Shinichi;, Assignee: Shinko Electric Industries Co., Ltd. (Nagano, JP) |
Method of mounting semiconductor chip for producing semiconductor device and a chip-supporting member used therein
A first object of the present invention is to provide a method of mounting a semiconductor chip to a supporting member by soldering, which does not develop injury or cracking of the chip. A second obj... Read More
Inventors: Ohno, Junji;, Assignee: Nippon Gakki Seizo Kabushiki Kaisha (Hamamatsu, JP) |
Hermetic sealing cover and a method of producing the same
OF THE INVENTION Referring to FIG. 1 in further detail, there is shown a hermetic sealing cover assembly embodying this invention. It includes a seal ring 6 having its whole surface coated with a thi... Read More
Inventors: Miyoshi, Akio; Fukami, Akira;, Assignee: Sumitomo Metal Mining Co., Ltd. (Tokyo, JP) |
Infrared transparent glass ceramic articles with beta-quarts solid solution crystals without any other crystals
IT is an object of the present invention to provide an infrared transparent glass ceramic article consisting of .beta.-quartz solid solution crystals alone dispersed within a glass matrix and displayi... Read More
Inventors: Shibuya, Takehiro; Matsui, Kazuhiro; Matsumoto, Makoto;, Assignee: Nippon Electric Glass Company, Limited (Otsu, JP) |
Solder terminal
The present invention provides a solution to all of the above problems by providing a terminal having a mounting portion, a seating portion joining the mounting portion including a transverse hole, an... Read More
Inventors: White, Donald Richard;, Assignee: E. I. Du Pont de Nemours and Company (Wilmington, DE) |
Solder bearing clip
What I claim is: 1. An edge clip for securement to a contact pad on a circuit-bearing substrate, comprising a clip body portion of sheet metal and at least one compact mass of solder, the body portion... Read More
Inventors: Seidler, Jack;, Assignee: North American Specialties Corporation (Flushing, NY) |
Cable clamp
In accordance with the present invention, a novel clamp device is disclosed which provides improved installation characteristics with lower unit cost and weight than that found in the prior art. This ... Read More
Inventors: Franks, Jr., George J.;, Assignee: |
Selective multiconnector block
We claim: 1. A connector assembly for standardizing wiring within each of a plurality of automobiles, said connector assembly being characterized by: a standardized junction block for use in all of sa... Read More
Inventors: Maue, H. Winston; Henderson, Brian E.; Szudarek, Robert G.; Wolanzyk, Thomas C.;, Assignee: United Technologies Automotive, Inc. (Dearborn, MI) |
Compositely insulated conductor riser cable
The foregoing needs which must be met in an economical manner in order to satisfy various building codes in today's environment are met by the cable of this invention. A cable of this invention is cha... Read More
Inventors: Dougherty, Timothy S.; Kissell, John J.; Schmehl, Glenn L.;, Assignee: Western Electric Company, Inc. (New York, NY) |
Glass-to-glass sealing method with conductive layer
The applicant has developed a method of assembly of vacuum fluorescent devices which eliminates the problems of the prior art. The applicant's invention eliminates the need to clean the metallic oxide... Read More
Inventors: DuBois, Richard;, Assignee: Wagner Electric Corporation (Parsippany, NJ) |
Glass to nickel-iron alloy seal
It has been discovered, surprisingly, that a particular combination of the oxide constituents in the known borosilicate glass composition provides a transformation temperature for the modified glass n... Read More
Inventors: Graff, William A.; Thomas, George L.;, Assignee: General Electric Company (Schenectady, NY) |
Glass- or ceramic-to-metal seals
OF THE INVENTION Ring lasers typically are fabricated from a block of glass or glass-like ceramics. Metal anodes and cathodes are attached to the glass or glass-like ceramic block. Typically the cath... Read More
Inventors: Norvell, Gordon S.; King, Donald W.;, Assignee: Litton Systems, Inc. (Beverly Hills, CA) |
Self-biased magnetoresistive reproduce head
What is claimed is: 1. A magnetic head comprising: a. a first thin magnetic film disposed to coact with a signal pre-recorded on a magnetic recording medium, said first thin magnetic film having major... Read More
Inventors: Doyle, William D.;, Assignee: Eastman Kodak Company (Rochester, NY) |
Protective relay interface
According to the invention there is provided a protective relay communication interface to interface a local relay to a communication linked relay, which interface comprises a communication input for ... Read More
Inventors: Kratt, III, Edward J.; Quam, David H.;, Assignee: RFL Electronics Inc. (Boonton, NJ) |
Monolithic surface ornamentation of pre-cast reinforced concrete wall
I claim: 1. A method of forming a monolithic decorative surface in a vertical concrete wall and having the appearance of mortar jointed blocks, comprising, (a) forming a mold having a projecting surfa... Read More
Inventors: Diana, Silvio;, Assignee: |
Methods of forming contoured walls
The present invention relates to a form liner adapted for use in forming a wall having a natural stone wall contour. The form liner includes a lateral relief mold face having a plurality of recessed p... Read More
Inventors: Nasvik, Peter A.; Nasvik, Paul C.;, Assignee: Concrete Design Specialties, Inc. (St. Paul, MN) |
Method for producing replicated paving stone
The present invention relates to a replicated paving stone such as slate and the method for producing the replicated paving stone. As described more fully hereinafter, the method produces the replicat... Read More
Inventors: Lowe, Michael;, Assignee: |
MR head with complementary easy axis permanent magnet
In the interest of clarity, it is thought best to describe a magnetic head according to the invention in terms of the way in which such head is fabricated. See FIG. 4: Given a non-magnetic substrate ... Read More
Inventors: Smith, Neil;, Assignee: Eastman Kodak Company (Rochester, NY) |
Metal Working 
