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Details
Inventors: Thomas, Mark S.; Fox, Ronald E.; Petropoulos, Mark C.; Pietrzykowski, Jr., Stanley J.;
Assignee: Xerox Corporation (Stamford, CT)
Primary Examiner: Rodee; Christopher D.
Assistant Examiner: Juska; Cheryl
Attorney, Agent or Firm: Soong; Zosan S.

A method is disclosed including: (a) dip coating a batch of substrates, each substrate defining an end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part of the top region of each substrate, wherein the first layer includes a wet coating solution bead formed at the end region of each substrate, thereby resulting in a plurality of wet coating solution beads; (b) directing a gas simultaneously at the entire plurality of the wet coating solution beads to remove a portion of the solvent in each bead, wherein the gas fails to disrupt the coating uniformity of the part of the first layer over the center region of each substrate; and (c) dip coating the batch of the substrates subsequent to (b) with a second coating solution to deposit a second layer over the first layer, wherein the portion of the solvent removed from each bead in (b) is sufficient to prevent contamination of the second coating solution by the first layer.

DETAILED DESCRIPTION The present invention is accomplished in embodiments by providing a coating method comprising: (a) dip coating a batch of substrates, each substrate defining an end region, a center region, and a top region, with a first coating solution including a solvent to deposit a first layer on the end region, the center region, and optionally on a part of the top region of each substrate, wherein the first layer includes a wet coating solution bead formed at the end region of each substrate, thereby resulting in a plurality of wet coating solution beads; (b) directing a gas simultaneously at the entire plurality of the wet coating solution beads to remove a portion of the solvent in each bead, wherein the gas fails to disrupt the coating uniformity of the part of the first layer over the center region of each substrate; and (c) dip coating the batch of the substrates subsequent to (b) with a second coating solution to deposit a second layer over the first layer, wherein the portion of the solvent removed from each bead in (b) is sufficient to prevent contamination of the second coating solution by the first layer.
In embodiments, the substrates have an endless, hollow configuration with the end region being open, and (b) comprises positioning the batch of the substrates over a gas channelling structure and directing the gas through the structure simultaneously at the entire plurality of the wet coating solution beads, wherein the gas also enters into the substrate interior.
In other embodiments of the present invention, the substrates have an endless, hollow configuration with the end region being open, and (b) comprises positioning the batch of the substrates over a gas channelling structure which includes a table member, wherein the table member defines a plurality of holes, and directing the gas through the holes in the table member simultaneously at the entire plurality of the wet coating solution beads, wherein the gas also enters into the substrate interior.



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