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Plenum bypass serial fan cooling subsystem for computer systems
| Details |
Inventors: Mills, R. Steven;
Assignee: Dell USA, L.P. (Austin, TX)
Primary Examiner: Tolin; Gerald P.
Assistant Examiner:
Attorney, Agent or Firm: Garrana; Henry N., Kahler; Mark P., Turner; Michelle M.
A cooling subsystem and method for a chassis of a computer system. The cooling subsystem comprises: (1) first and second cooling fans having first and second motors associated therewith for driving the first and second cooling fans, respectively and (2) a common plenum substantially shrouding and providing a pathway for air communication between the first and second cooling fans, the first and second fans cooperating to provide an optimum rate of air flow from without the chassis to within the chassis to provide air exchange within the chassis, the air flow within the chassis being in a predetermined direction to provide directed cooling of a specified device within the chassis, the common plenum allowing the first and second fans to continue to cooperate to provide a minimum air flow to provide a minimum air exchange within the chassis, the air flow remaining in the predetermined direction to continue the directed cooling of the specified device when a selected one of the first and second motors fails. The plenum comprises a bypass aperture therein for allowing the air to alternatively enter and exit the plenum, the bypass aperture increasing a rate of air flow across the subsystem when a selected one of the first and second motors fails. |
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DETAILED DESCRIPTION To address the above-discussed deficiencies of the prior art, it is a primary object of the present invention to provide a cooling subsystem for a computer system.
The subsystem should allow for failure of a single fan without unduly compromising air exchange capacity or force-cooling of specified components of the computer system.
Additionally, the subsystem should have a low impedance to air flow when a single fan fails.
In the attainment of the above primary object, the present invention provides a cooling subsystem and method for a chassis of a computer system.
The cooling subsystem comprises: (1) first and second cooling fans having first and second motors associated therewith for driving the first and second cooling fans, respectively and (2) a common plenum substantially shrouding and providing a pathway for air communication between the first and second cooling fans, the first and second fans cooperating to provide an optimum rate of air flow from without the chassis to within the chassis to provide air exchange within the chassis, the air flow within the chassis being in a predetermined direction to provide directed cooling of a specified device within the chassis, the common plenum allowing the first and second fans to continue to cooperate to provide a minimum air flow to provide a minimum air exchange within the chassis, the air flow remaining in the predetermined direction to continue the directed cooling of the specified device when a selected one of the first and second motors fails.
The plenum comprises a bypass aperture therein for allowing the air to alternatively enter and exit the plenum, the bypass aperture increasing a rate of air flow across the subsystem when a selected one of the first and second motors fails.
In a preferred embodiment of the present invention, the first cooling fan is downstream of the second cooling fan and the first and second cooling fans contrarotate.
The air flow from the first cooling fan moves in substantial alignment with vanes of the second cooling fan when the second motor fails to thereby lower a pressure differential across the second cooling fan
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