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Self-contained modular pivot, notably for robots
This invention relates in general to articulations or like pivot means and has specific reference to a self-contained modular pivot intended for use notably in various ...
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Apparatus and gauges for use in measuring the diameter of a buffed tire in relation to a particular matrix
I claim: 1. Apparatus for use in measuring the diameter of a tire of a particular nominal size that has been buffed and is to be provided with a predetermined thickness ...
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Making memory structure for laser recording system
In accordance with the present invention, a thermoplastic memory is formed by depositing two layers of material upon a metallic substrate such as aluminum. The first or ...
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Method for adjusting a semiconductor disk relative to a radiation mask in x-ray photolithography
It is an object of the invention to disclose an adjusting process for utilization in x-ray photolithography, in which a thin-etching process of the semiconductor disks ...
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Apparatus and method for optical clearance determination
In carrying out one form of my invention, I provide apparatus for optically determining the clearance between an edge of at least one translating member and a relatively ...
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Method for inspecting gear contact patterns
We claim: 1. Method for inspecting a gear contact pattern on a tooth surface of a gear tooth of a gear which comprises the steps of determining on the tooth surface of ...
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Bow sight
An improved bow sight enables an archer to shoot with a high degree of accuracy. The bow sight provides ready adjustment to compensate for different shooting distances ...
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Plasma pretreatment with BCl.sub.3 to remove passivation formed by fluorine-etch
Referring now to FIGS. 1 thru 4, there are shown cross-sectional views of portions of a partially completed exemplary VLSI silicon-gate MOS device 10 illustrating ...
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Method of measuring the thickness of the removed layer in subtractive workpiece processing
It is the object of the invention to provide a method of measuring the removed layer thickness in subtractive workpiece processing which can be implemented reliably and ...
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Method of planarizing the surface of a semiconductor device, in which silicon nitride is used as isolating material
What is claimed is: 1. In a method of planarizing the surface of a semiconductor device comprising a substrate carrying in relief on its surface at least one contact ...
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