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Device and method for scrubbing and cleaning substrate
| Details |
Inventors: Tanoue, Kouichi; Kitamura, Shinzi; Anai, Noriyuki; Satoh, Takami; Tomoeda, Takayuki; Iwasaki, Tatsuya; Mizosaki, Kengo;
Assignee: Tokyo Electron Limited (Tokyo, JP); Tokyo Electron Kyushu Limited (Tosu, JP)
Primary Examiner: Roberts; Edward L.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt
A substrate scrubbing and cleaning device comprising a mechanism having an upper and a lower brush members for scrubbing both surfaces of an LCD glass substrate, a mechanism for rotating the upper and lower brush members, a mechanism for supplying pure water to the upper and lower brush members, a mechanism for carrying the substrate between the upper and the lower brush members to reciprocate it relative to the upper and lower brush members in a substrate carrying direction, and a controller for controlling the operation of the substrate carrying mechanism. |
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DETAILED DESCRIPTION An object of the present invention is therefore to provide a scrubbing and cleaning device, more functional and more compact, but capable of scrubbing substrates such as LCD ones each having a large area.
Another object of the present invention is to provide a scrubbing and cleaning method having a higher rinsing capacity (even after the scrubbing process) and which is capable of cleaning substrates, such as LCDs ones each having a large area, at a higher speed.
According to an aspect of the present invention, there can be provided a scrubbing and cleaning device comprising means having an upper and a lower brush members for scrubbing both surfaces of a substrate; means for rotating the upper and lower brush members, respectively; means for supplying cleaning solution to the upper and lower brush members, respectively; means for carrying the substrate between the upper and the lower brush members and for reciprocating the substrate relative to the upper and lower brush members in a substrate carrying direction; and means for controlling the operation of the substrate carrying means.
According to the scrubbing and cleaning device, the substrate is reciprocated between the upper and the lower brush members to enable the substrate to be maintained at the scrubbing position for a longer time.
This enables the substrate scrubbing time to be extended to more completely clean the substrate.
In addition, the device can be made more compact in size but clean large-sized substrates at a higher speed.
Further, the substrate cleaning device includes a mechanism for supplying water to each brush through the center of the brush to clean the brush itself when the brushes are left inoperative.
This makes it possible to clean the brushes without supplying pure water to them through rinsing nozzles.
This also make it possible to prevent the brushes from being deformed by high pressure pure water supplied through the substrate cleaning rinse nozzles.
The running cost can be thus made lower and the frequency of maintaining the device can also be reduced
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