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Electronic coatings using filled borosilazanes
| Details |
Inventors: Haluska, Loren A.; Michael, Keith W.;
Assignee: Dow Corning Corporation (Midland, MI)
Primary Examiner: Lusignan; Michael
Assistant Examiner:
Attorney, Agent or Firm: Gobrogge; Roger E.
The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a borosilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic coating. |
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DETAILED DESCRIPTION OF THE INVENTION The present invention is based on the discovery that desirable protective coatings can be formed on electronic substrates from compositions comprising borosilazanes and fillers.
Coatings derived therefrom are thicker (eg.
, >40 microns) than those derived from borosilazanes (eg.
, <2 microns), they can have a variety of electrical properties depending on the filler and they can be crack and pore-free.
Because of the above advantages, these coatings are particularly valuable on electronic substrates.
Such coatings could serve, for example, as passivation or dielectric coatings, interlevel dielectric layers, doped dielectric layers to produce transistor like devices, pigment loaded binder systems containing silicon to produce capacitor and capacitor like devices, multilayer devices, 3-D devices, silicon on insulator devices, coatings for superconductors, super lattice devices, conductive coatings, magnetic coatings, tamperproof coatings and the like.
As used in the present invention, the expression "ceramic coating" is used to describe the hard borosilicate containing coating obtained after heating the borosilazane--filler composition.
In addition to the filler, this coating contains Si-O and B-O bonds which may or may not be fully free of residual carbon, hydrogen, and/or nitrogen but which are otherwise ceramic in character; The expression "filler" is used to describe a finely divided solid phase which is distributed within the borosilazane and the final ceramic coating.
The expression "electronic substrate" is meant to include, but is not limited to, electronic devices or electronic circuits such as silicon based devices, gallium arsenide based devices, focal plane arrays, opto-electronic devices, photovoltaic cells and optical devices.
In the process of the present invention a ceramic coating is formed on a substrate by a process which comprises applying a coating composition comprising a borosilazane and a filler onto the substrate and then heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic
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