Low temperature curing resin system

DETAILED DESCRIPTION What is claimed is: 1.
A low temperature curing epoxy resin system comprised of a polymerizable glycidyl ether epoxy resin and a curing agent consisting of an eutectic mixture of piperidine and an alkyl substituted imidazole.
2.
The resin system of claim 1 wherein said curing agent is of from 9 to 5 parts by weight of 2-ethyl, 4-methyl imidazole and from 1-5 parts by weight of piperidine.
3.
The resin system of claim 2 wherein said epoxy resin is a diglycidyl ether of bis-phenol A having an epoxide equivalent weight of 180-190.
4.
The resin system of claim 2 wherein 10 parts by weight of said curing agent is added to 100 parts by weight of a diglycidyl ether of bis-phenol A.
5.
The resin system of claim 4 wherein said curing agent consists of 4 parts by weight of piperidine and 6 parts by weight of 2-ethyl, 4-methyl imidazole.




Description:
BACKGROUND OF THE INVENTION 1.
Field of the Invention The invention is a new composition of matter which generally relates to epoxy resin and more particularly to low temperature curing resins.
Similar materials have been examined by group art unit 120; however, an examination by Group Art Unit 140 would also be appropriate.
2.
Description of the Prior Art Waveguides, used in the electronics industry, have in the past been fabricated from various metals.
While such waveguides have been generally considered to be useful, attempts to improve performance, i.
e.
, achieve a reduction in the cost, weight and thermal expansion coefficients while increasing the dimensional stability of waveguides resulted in the investigation of graphite filled composites as structural materials.
The successful utilization of composites in waveguide structures for space applications imposes several important constraints on the resin system and the cured matrix obtained from it.
Relatively low curing temperatures should yield a composite with greatly improved dimensional stability, since such a composite would be expected to contain far less residual stresses due to the differential expansion of the matrix and the reinforcement