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Method for manufacturing resin-molded semiconductor device
| Details |
Inventors: Oida, Seishi; Yamaguchi, Yukio; Suematsu, Nobuhiro; Morikawa, Takeshi; Yamada, Yuichiro;
Assignee: Matsushita Electronics Corporation (Osaka, JP)
Primary Examiner: Ortiz; Angela
Assistant Examiner:
Attorney, Agent or Firm: McDermott, Will & Emery
According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet. |
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DETAILED DESCRIPTION In view of these problems caused in accordance with the thickness of the sealing sheet, an object of the present invention is to provide a method for manufacturing a resinmolded semiconductor device that can always prevent heat shrinkage from generating wrinkles on the sealing sheet irrespective of the thickness of the sheet and can control the depth of the groove formed around the side faces of the inner lead portion of the resin-molded semiconductor device, i.
e.
, the amount of the sealing sheet which is thermally shrunk to force its way inward on the side faces of the inner lead portion during resin molding.
In order to solve the problems, the present invention provides an improved method for manufacturing a resin-molded semiconductor device that is principally characterized by the technique of encapsulating the surface of a lead frame, on which a semiconductor chip is bonded, with a molding compound.
According to the present invention, a method for manufacturing a resin-molded semiconductor device is provided.
In the semiconductor device, a lead frame bonded with a semiconductor chip is encapsulated with a molding compound by interposing a sealing sheet within a molding die.
In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
Specifically, in one embodiment of the present invention, the sealing sheet is caused to stick to the molding die by a plurality of vacuum suction devices, which are formed in the molding die at substantially regular intervals, thereby equally applying tension to the sheet and encapsulating the lead frame with the molding compound.
According to another method for manufacturing a resin-molded semiconductor device of the present invention, parts of the sealing sheet, which come into contact with an inner lead portion of the lead frame, are allowed to fill in respective concave portions formed in the molding die, thereby adhering the sealing sheet to the lead frame and encapsulating the lead frame with the resin
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