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| Method of making a headliner and the like |
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| Method for forming plastic molded panels with inserts |
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| Laminated headliner |
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Method for manufacturing white light-emitting diodes
| Details |
Inventors: Lee, Jeong-Hoon; Kanekiyo, Joufuku; Kim, Kwang-Jung;
Assignee: Lee; Jeong-Hoon (Seoul, KR)
Primary Examiner: Pham; Long
Assistant Examiner:
Attorney, Agent or Firm: Bacon & Thomas, PLLC
Disclosed is a method for manufacturing white light-emitting diodes (white LEDs) which is capable of manufacturing white LEDs having a superior and uniform quality and a slim structure while simplifying the manufacturing process, thereby reducing the manufacturing costs and time, and achieving a considerable improvement in the yield of those white LEDs. The method involves the steps of mixing a fluorescent dye, adapted to convert blue light into white light, with molding compound powder, thereby preparing a mixture, subjecting the mixture to a desired temperature and a desired pressure, thereby shaping the mixture to have a desired shape, simultaneously transfer-molding the shaped mixture on the blue-light emitting diode chips, thereby forming a molded product, and dicing the molded product into individual white LEDs. Since the method of the present invention eliminates use of a potting process used in conventional methods, it can manufacture white LEDs having a slim structure. In accordance with the method of the present invention, the manufacturing process is simplified, thereby reducing the manufacturing costs and time. Also, it is possible to achieve a considerable improvement in the yield of white LEDs having a superior and uniform quality. |
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DETAILED DESCRIPTION Therefore, an object of the invention is to provide a method for manufacturing white LEDs, which involves the steps of mixing a fluorescent dye with molding compound powder such as resin powder, compressing the mixture, thereby producing a molding compound compact, and transfer-molding the molding compound compact on a blue LED chip, thereby being capable of forming a white LED serving to convert blue light emitted from the blue LED chip into white light, thereby emitting the white light, while eliminating the potting process used in conventional cases, thereby allowing the white LED to have a slim structure suitable for back illumination for LCDs and other displays used in electronic products having a light-weight, slim, simple, and miniaturized structure, simplifying the manufacturing process to reduce the manufacturing costs and the time taken in manufacturing the white LED, and achieving a considerable improvement in the yield of products having a desired quality.
In accordance with the present invention, this object is accomplished by providing a method for manufacturing white light-emitting diodes adapted to convert a blue light emitted from blue light-emitting diode chips into white light using a fluorescent dye, each of the blue-light emitting diode chips being mounted on a printed circuit board or a lead frame while being bonded to the printed circuit board or the lead frame by a conductive or non-conductive adhesive and having electrodes electrically connected with a circuit pattern plated on the printed circuit board or the lead frame, comprising the steps of: mixing the fluorescent dye with molding compound powder, thereby preparing a mixture; subjecting the mixture to a desired temperature and a desired pressure, thereby shaping the mixture to have a desired shape (for example, a tablet shape); simultaneously transfer-molding the shaped mixture on the blue-light emitting diode chips, thereby forming a molded product; and dicing the molded product into individual white light-emitting diodes using, for example, a dicer
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Nonmetallic Processes 
