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Method of manufacturing ceramic circuit board
| Details |
Inventors: Matsumura, Kazuo; Tanaka, Tadashi; Tsurutani, Shoji;
Assignee: Kabushiki Kaisha Toshiba (Kanagawa, JP)
Primary Examiner: Powell; William A.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt
A ceramics circuit board is manufactured by preliminarily preparing a circuit pattern base composed of a plurality of circuit pattern elements connected by bridging pieces each having a thickness smaller than that of the circuit pattern element, preferably less than half thickness of the circuit pattern base, applying and bonding the circuit pattern base onto one surface of a ceramics board base and removing the bridging pieces by effecting an etching treatment to thereby form a circuit pattern having a predetermined shape on the one surface of the ceramics board base. The circuit pattern base and the bridging pieces are formed of one metallic plate by partially effecting etching treatment. The bridging pieces are arranged so as to have a gap between a rear surface thereof and the one surface of the ceramics board base when the circuit pattern base is applied on the one surface of the ceramics board base. The bonding step may be carried out by forming, on a surface to be bonded, an eutectic material composed of the same metallic material as that composing the circuit pattern base and oxygen. It is preferred that the method further includes the step of applying and bonding a copper plate to another surface of the ceramics board base before the etching treatment. |
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DETAILED DESCRIPTION An object of the present invention is to substantially eliminate the defects or drawbacks encountered in the prior art described above and to provide a method of preparing a ceramic circuit board capable of manufacturing the ceramic circuit board having a precise circuit pattern arrangement with substantially no deformation or positional displacement of the circuit pattern.
In order to achieve this and other objects, the inventors of the subject application conceived the present invention particularly in consideration of the following matters.
In the repeated tests and examinations of the method for reducing the deformation of the circuit pattern base to effectively form the circuit pattern as the ceramic circuit board with high precision and performance, it was found out that the circuit board with remarkably reduced deformation could be obtained with high reliability by removing the bridging pieces connecting the respective circuit pattern elements by effecting the etching treatment which does not cause mechanical shock or impact.
Namely, the method of manufacturing a ceramics circuit board according to the present invention characterized by comprising the steps of preparing a ceramics board base, preparing a circuit pattern base composed of a plurality of circuit pattern elements connected by bridging pieces each having a thickness smaller than that of the circuit pattern element, applying the circuit pattern base on one surface of the ceramic board base and removing the bridging pieces by an etching treatment to thereby form a circuit pattern having a predetermined shape on one surface of the ceramic board base.
In preferred embodiments, the circuit pattern base and the bridging pieces are formed of one metallic plate by partially effecting etching treatment.
A plating may be made on the circuit pattern surface after the etching treatment.
It is desired that the bridging piece has a thickness less than half of the circuit pattern base, and more preferably, a thickness of 0
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Nonmetallic Processes 
