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| Measuring head |
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| Optically readable information disc |
| OF THE INVENTION In a favourable embodiment the substrate plate is composed of 40-60% by weight of ... |
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| Injection molding machines having a brushless DC drive system |
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| Silylation process |
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| Photographic element and patternable mordant composition |
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| Apparatus for detecting a mutual positional relationship of two sample members |
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| Alignment measuring system and method |
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| Snap-on flow measurement system |
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Method of planarizing the surface of a semiconductor device, in which silicon nitride is used as isolating material
| Details |
Inventors: Fabien, Raymond; Decrouen, Jean-Michel;
Assignee: U.S. Philips Corporation (New York, NY)
Primary Examiner: Bashore; S. Leon
Assistant Examiner: Anderson; Andrew J.
Attorney, Agent or Firm: Miller; Paul R.
A method of planarizing the surface of a semiconductor device comprising a substrate carrying on its surface a contact configuration, which method essentially consists in that the following steps are successively carried out: (a) depositing a silicon nitride layer, (b) depositing a lacquer layer, whose free surface is substantially flat, (c) progressively attacking by plasma the lacquer layer until the farthest projecting parts of the silicon nitride layer are completely exposed, the complete appearance of these farthest projecting parts being detected by recording the intensity variations of an emitted jet of nitrogen, (d) attacking simultaneously by plasma the silicon nitride layer and the remaining lacquer until the contact configuration completely appears. This method is characterized in that the conditions of attack are chosen so that the rate of attack of the lacquer is higher than the rate of attack of the silicon nitride in order to detect with increased sensitivity the complete appearance of the contact configuration. |
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DETAILED DESCRIPTION What is claimed is: 1.
In a method of planarizing the surface of a semiconductor device comprising a substrate carrying in relief on its surface at least one contact configuration cut out of a contact layer, which method comprises successively carrying out the following steps: (a) depositing a silicon nitride layer having a thickness substantially equal to that of the contact layer, (b) depositing a lacquer layer having a given thickness and then treating the layer, wherein the kind, the thickness and the treatment of the lacquer layer are such that the free surface of this layer is substantially flat, (c) progressively attacking by plasma the lacquer layer until the farthest projecting parts of the silicon nitride layer are completely exposed in order that a new free surface is reproduced, whose flatness is an image of that of the free surface of the lacquer layer, the complete appearance of the farthest projecting parts of the nitride layer being detected by means of a device for recording the intensity variations of an emitted jet of nitrogen, and (d) attacking simultaneously, also by plasma, the silicon nitride layer and the remaining lacquer until the contact configuration appears completely; the improvement comprising choosing the conditions of attack during the step of simultaneously attacking the silicon nitride layer and the remaining lacquer so that the rate of attack of the lacquer is higher than the rate of attack of the silicon nitride so that the lacquer is completely removed before the appearance of the contact configuration, in order to detect with increased sensitivity by means of the recording device the complete appearance of the contact configuration.
2.
A method as claimed in claim 1, wherein the plasma is formed from a gaseous mixture containing a fluorine compound and oxygen or a compound of oxygen, and wherein the rate of attack of the lacquer is made higher than the rate of attack of the silicon nitride by increasing the quantity of the oxygen or oxygen compound in the gaseous mixture
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Nonmetallic Processes 
