Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home Nonmetallic Processes Paired-electrodes-for-plasma-chambers

 Disposable posts for self-aligned non-enclosed contacts
The invention advantageously simplifies typical interconnect-contact formation processes for ...


 Gapfill of semiconductor structure using doped silicate glasses
The invention relates to improved gap fill of narrow spaces in the fabrication of integrated ...


 Projection optical apparatus
It is an object of the present invention to provide a projection optical apparatus capable of ...


 Ion implanter
An object of the present invention is to provide an ion implanter of preventing electrostatic ...


 Semiconductor etching apparatus with magnetic array and vertical shield
The semiconductor wafer etching device uses an RF etch in an argon atmosphere in combination with ...


 Distributed-array magnetron-plasma processing module and method
According to one aspect of the present invention, there is provided a semiconductor wafer plasma ...


 Plasma generating device
OF THE INVENTION The figures schematically show different ways of practical embodiments of plasma ...


 Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor
The present invention achieves the foregoing objectives by addressing the root cause of the ...


 Coaxial microwave applicator for an electron cyclotron resonance plasma source
It is therefore an object of the present invention to provide a method and apparatus for producing ...


 Aqueous magnetorheological material
OF THE INVENTION The compositions form a thixotropic network that is effective at minimizing ...


 Paired electrodes for plasma chambers

Details
Inventors: Fazlin, Fazal A.;
Assignee: Advanced Plasma Systems Inc. (St. Petersburg, FL)
Primary Examiner: Niebling; John F.
Assistant Examiner: Chapman; Terryence
Attorney, Agent or Firm: Stein, Reese & Prescott

A paired electrode for use in a plasma chamber. In one embodiment, the paired electrode comprises a plurality of angle members which are disposed parallel to one another. Pairs of the angle members are positioned facing one another, one functioning as a power electrode member and the other as a ground electrode member. All of the power electrode members are rigidly fastened to one another by means of a transverse power bus and all of the ground electrode members are rigidly fastened to one another by means of a transverse ground bus. The power bus and the ground bus are electrically connected to a power source, usually a RF power source and a ground of the plasma chamber, respectively. The plasma chamber contains a plurality of paired electrodes, and objects to be processed by plasma are placed between the paired electrodes.

DETAILED DESCRIPTION The invention is defined by the appended claims with a specific embodiment shown in the attached drawings.
For the purpose of summarizing the invention, the invention comprises a unique paired electrode for use in conjunction with plasma chambers.
In one embodiment, the paired electrodes of the invention comprises a plurality of angle members which are disposed parallel to one another.
Every two of the angle members are positioned facing one another, one functioning as a power electrode member and the other as a ground electrode member.
All of the power electrode members and all of the ground electrode members are rigidly fastened to one another by means of a transverse power bus and a transverse ground bus, respectively.
The power bus and the ground bus are then, respectively, electrically connected to the power, usually RF, and the ground of the plasma chamber.
In the other embodiment, the paired electrodes of the invention comprise a "Z" cross-sectional configuration which are positioned in facing relationship with one another by means of stand-offs and which are electrically connected to the power and ground of the plasma chambers by means of the transverse power and the transverse ground buses.
In both of the embodiments, a plurality of the electrode pairs are fastened together in the conventional form by means of longitudinal power and longitudinal ground bus bars interconnecting the power and ground buses of the electrode pairs.
The resulting electrode pair assembly is then inserted within the plasma chamber for use.
During use, the objects to be treated, such as printed circuit boards, are inserted into the areas between adjoining electrode pairs.
The lid to the chamber is closed and then gas is introduced.
As the gas flows from one end of the chamber to the other, the gas weaves through the opposing power and ground electrode members of each electrode pair, is exposed to a primary electric field, and is therefore excited to a plasma state.
As the gas continues to flow through or about the object toward the other adjoining electrode pair, the gas is maintained in its excited state by means of the existing secondary electric field between the adjoining electrode pairs



Related patents
  Desmearing and plated-through-hole apparatus
The invention comprises a plasma plated-through-hole apparatus and method which deposits a thin layer of material, such as metal, within the hole of an object, such as a ...
  Desmearing and plated-through-hole method
The invention comprises a plasma plated-through-hole apparatus and method which deposits a thin layer of material, such as metal, within the hole of an object, such as a ...
  Process chamber apparatus
OF THE INVENTION The present invention will now be described with reference to the accompanying drawings. FIGS. 1 to 6 illustrate a process chamber apparatus according ...
  Residue free vertical pattern transfer with top surface imaging resists
An object of the present invention is to provide a method for achieving a vertical wall profile in a TSI resist with residue free patterns. Another object of the present ...
  Planarization method
We claim: 1. A method of providing a planarized coating on a surface comprising the steps of applying a uniform coating of a prepolymer material selected from the group ...
  Polymerizable planarization layer for integrated circuit structures
It is therefore an object of the invention to provide planarization of an integrated circuit structure using a material which does not contain a solvent which will ...
  Block polymer compositions
What I claim as new and desire to secure by Letters Patent of the United States is: 1. A composition comprising (A) a silicone-organic block polymer resulting from the ...
  Non-toxic aryl onium salts, UV curable coating compositions and food packaging use
What is claimed is: 1. A non-toxic method for coating a substrate which comprises: (1) treating the surface of the substrate with a solventless photocurable mixture ...
  Ceramic products derived from polycarbosilanes and boroxines
The polycarbosilane which is mixed with the boroxine may be any polycarbosilane that is soluble in common organic solvents, such as aliphatic or aromatic hydrocarbons, ...
  Selected novolak resin planarization layer for lithographic applications
The planarization material of the present invention is a novolak resin made by reacting an aldehyde source with ortho-secondary butyl phenol alone or in combination ...

0.014

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved