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Nonmetallic Processes

Porous-materials

Thread-wound golf ball

Therefore, an object of the present invention is to provide a thread-wound golf ball having a ...

Homogenous copolymerization of non-polar monomers with ionic amphiphilic monomers

OF ILLUSTRATIVE EMBODIMENTS The nonionic monomers employed in the practice of this invention are ...

High-resilience ionomeric compositions for golf ball covers

OF THE INVENTION In the following disclosure the term `direct copolymer` means a copolymer made by ...

Golf ball cover

OF THE INVENTION The cover material of the present invention, and golf balls covered with this ...

Three-piece solid golf ball

OF THE INVENTION Hereinafter, the present invention will be explained in detail. Firstly, the ...

Golf ball and method of manufacture

OF THE INVENTION The golf balls of the invention are produced using standard choices for the core ...

Golf ball and method of making same

Therefore, an object of the present invention is to provide a golf ball featuring smooth mold ...

Multilayer golf ball

The present invention is directed towards a multi-layer golf ball which provides a soft feel ...

Golf ball

The present invention is directed towards a multi-layer golf ball which provides a softer feel ...

Golf ball

OF THE INVENTION This invention is particularly directed towards liquid filled center core shells ...

Porous materials

Details

Inventors: Gore, Robert H.; Gallagher, Michael K.; Ibbitson, Scott A.;
Assignee: Shipley Company, L.L.C. (Marlborough, MA)
Primary Examiner: Cooney, Jr.; John M.
Assistant Examiner:
Attorney, Agent or Firm: Cairns; S. Matthew

Porous polyimide dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous polyimide dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous polyimide dielectric material.

DETAILED DESCRIPTION OF THE INVENTION As used throughout this specification, the following abbreviations shall have the following meanings, unless the context clearly indicates otherwise: .
degree.
C.
=degrees centigrade; .
mu.
m=micron; UV=ultraviolet; rpm=revolutions per minute; nm=nanometer; g=gram; wt %=weight percent; L=liter; STY=styrene; DVB=divinylbenzene; ALMA=allyl methacrylate; EHA=2-ethylhexyl acrylate; EHMA=2-ethylhexyl methacrylate; MMA=methyl methacrylate; TMPTA=trimethylolpropane triacrylate; TMPTMA=trimethylolpropane trimethacrylate; HEMA=2-hydroxyethyl methacrylate; DMAEMA=dimethylaminoethyl methacrylate; BzA=benzylacrylate; and PPGMEA260=poly(propylene glycol) methyl ether acrylate having a molecular weight of about 260.
The term "(meth)acrylic" includes both acrylic and methacrylic and the term "(meth)acrylate" includes both acrylate and methacrylate.
Likewise, the term "(meth)acrylamide" refers to both acrylamide and methacrylamide.
"Alkyl" includes straight chain, branched and cyclic alkyl groups.
The term "porogen" refers to a pore forming material, that is a polymeric material or particle dispersed in a dielectric material that is subsequently removed to yield pores, voids or free volume in the dielectric material.
Thus, the terms "removable porogen," "removable polymer" and "removable particle" are used interchangeably throughout this specification.
The terms "pore," "void" and "free volume" are used interchangeably throughout this specification.
"Cross-linker" and "cross-linking agent" are used interchangeably throughout this specification.
"Polymer" refers to polymers and oligomers, and also includes homopolymers and copolymers.
The terms "oligomer" and "oligomeric" refer to dimers, trimers, tetramers and the like.
"Monomer" refers to any ethylenically or acetylenically unsaturated compound capable of being polymerized.
Such monomers may contain one or more double or triple bonds.
As used throughout this specification, the term "polyimide dielectric matrix material" refers to polyimide dielectric material having porogen dispersed or dissolved therein

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