Resin material in sheet form

DETAILED DESCRIPTION As a result of his extensive research, the inventor of this invention has discovered that a sheet of porous resinous material provided therethrough with a multiplicity of holes has a lower dielectric constant than the known material.
He has also found that those holes facilitate the movement of a fluid, can retain an adhesive therein when it is necessary to join a plurality of sheets with an improved adhesive strength, and can contain other material therein to provide a composite material having different properties.
It is, therefore, an object of this invention to provide a sheet of porous resinous material which can be used for a wider variety of applications than the known material.
According to this invention, there is, thus, provided a sheet of porous resinous material having a multiplicity of holes formed therethrough.
The various advantages which may result from the provision of those holes as hereinabove set forth make the sheet of this invention suitable for use in a wide variety of applications.
It is not only appropriate for use in electrical insulation, but can also be used in sensors, buffer material, heat insulation and lamination.