Wet lamination process and apparatus
OF THE PREFERRED EMBODIMENTS Referring to FIG. 1, there is illustrated apparatus at 10 and a method for laminating a photopolymerizable film, illustrated at 12, onto one or both surfaces 14 of a subs... Read More
Inventors: Correa, Jose L.; Stumpf, Robert C.; Farnum, Charles L.; Roos, Leo;, Assignee: Morton International, Inc. (Chicago, IL) |
Plasma desmearing apparatus and method
The present invention is directed to employing a rectilinear chamber for desmearing in which the two transitional ends are frustopyramidal in configuration. Each frustropyramidal diffusion chamber has... Read More
Inventors: Fazlin, Fazal A.;, Assignee: |
Paired electrodes for plasma chambers
The invention is defined by the appended claims with a specific embodiment shown in the attached drawings. For the purpose of summarizing the invention, the invention comprises a unique paired electro... Read More
Inventors: Fazlin, Fazal A.;, Assignee: Advanced Plasma Systems Inc. (St. Petersburg, FL) |
Desmearing and plated-through-hole apparatus
The invention comprises a plasma plated-through-hole apparatus and method which deposits a thin layer of material, such as metal, within the hole of an object, such as a printed circuit board. The inv... Read More
Inventors: Fazlin, Fazal A.; Lee, Rex A.;, Assignee: Advanced Plasma Systems, Inc. (St. Petersburg, FL) |
Desmearing and plated-through-hole method
The invention comprises a plasma plated-through-hole apparatus and method which deposits a thin layer of material, such as metal, within the hole of an object, such as a printed circuit board. The inv... Read More
Inventors: Fazlin, Fazal A.; Lee, Rex A.;, Assignee: Advanced Plasma Systems, Inc. (St. Petersburg, FL) |
Process chamber apparatus
OF THE INVENTION The present invention will now be described with reference to the accompanying drawings. FIGS. 1 to 6 illustrate a process chamber apparatus according to an embodiment of the present... Read More
Inventors: Arami, Junichi; Endo, Shosuke;, Assignee: Tokyo Electron Limited (Tokyo, JP) |
Residue free vertical pattern transfer with top surface imaging resists
An object of the present invention is to provide a method for achieving a vertical wall profile in a TSI resist with residue free patterns. Another object of the present invention is to use O.sub.2 on... Read More
Inventors: Sachdev, Harbans S.; Forster, John C.; Linehan, Leo L.; MacDonald, Scott A.; Muller, K. Paul L.; Mlynko, Walter E.; Somerville, Linda K.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Planarization method
We claim: 1. A method of providing a planarized coating on a surface comprising the steps of applying a uniform coating of a prepolymer material selected from the group consisting of diacetylenic prep... Read More
Inventors: Economy, James; Flandera, Mary A.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Polymerizable planarization layer for integrated circuit structures
It is therefore an object of the invention to provide planarization of an integrated circuit structure using a material which does not contain a solvent which will evaporate. It is another object of t... Read More
Inventors: Brown, Andrew V.;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
Block polymer compositions
What I claim as new and desire to secure by Letters Patent of the United States is: 1. A composition comprising (A) a silicone-organic block polymer resulting from the free-radical polymerization in t... Read More
Inventors: Crivello, James V.;, Assignee: General Electric Company (Schenectady, NY) |
Non-toxic aryl onium salts, UV curable coating compositions and food packaging use
What is claimed is: 1. A non-toxic method for coating a substrate which comprises: (1) treating the surface of the substrate with a solventless photocurable mixture comprising by weight (A) A non-toxi... Read More
Inventors: Crivello, James V.; Lee, Julia L.;, Assignee: General Electric Company (Schenectady, NY) |
Ceramic products derived from polycarbosilanes and boroxines
The polycarbosilane which is mixed with the boroxine may be any polycarbosilane that is soluble in common organic solvents, such as aliphatic or aromatic hydrocarbons, dialkyl or alicyclic ethers, et... Read More
Inventors: Niebylski, Leonard M.;, Assignee: Ethyl Corporation (Richmond, VA) |
Selected novolak resin planarization layer for lithographic applications
The planarization material of the present invention is a novolak resin made by reacting an aldehyde source with ortho-secondary butyl phenol alone or in combination with other phenolic moieties under... Read More
Inventors: Rogler, Robert F.;, Assignee: OCG Microelectronic Materials, Inc. (West Paterson, NJ) |
Disposable posts for self-aligned non-enclosed contacts
The invention advantageously simplifies typical interconnect-contact formation processes for semiconductor device fabrication by eliminating the need to use an etch through the insulating layer to cre... Read More
Inventors: Cleeves, James M.;, Assignee: Cypress Semiconductor Corporation (CA) |
Gapfill of semiconductor structure using doped silicate glasses
The invention relates to improved gap fill of narrow spaces in the fabrication of integrated circuits. Improved gap fill is achieved by providing a doped silicate glass having a dopant concentration g... Read More
Inventors: Kirchhoff, Markus M.; Ilg, Matthias;, Assignee: Siemens Aktiengesellschaft (Munich, DE) |
Projection optical apparatus
It is an object of the present invention to provide a projection optical apparatus capable of detecting variations in the optical characteristics of its imaging optical system from time to time. It is... Read More
Inventors: Tanimoto, Akikazu; Ishizaka, Shoji;, Assignee: Nippon Kogaku K.K. (Tokyo, JP) |
Ion implanter
An object of the present invention is to provide an ion implanter of preventing electrostatic discharge damage caused by charge potential, by effectively trapping secondary electrons generated from a ... Read More
Inventors: Nakanishi, Koichiro; Fujii, Haruhisa; Muto, Hirotaka;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Semiconductor etching apparatus with magnetic array and vertical shield
The semiconductor wafer etching device uses an RF etch in an argon atmosphere in combination with an array of fixed cobalt-samarium magnets which confine the resulting plasma to a double loop. A verti... Read More
Inventors: Chow, Robert; Downey, Steven D.;, Assignee: Varian Associates, Inc. (Palo Alto, CA) |
Distributed-array magnetron-plasma processing module and method
According to one aspect of the present invention, there is provided a semiconductor wafer plasma processing magnetron module for plasma-assisted processing of a semiconductor wafer that properly dispe... Read More
Inventors: Moslehi, Mehrdad M.; Davis, Cecil J.;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Plasma generating device
OF THE INVENTION The figures schematically show different ways of practical embodiments of plasma generating devices, wherein the illustrated examples-show sputtering devices. The same functioning ca... Read More
Inventors: Grunenfelder, Pius;, Assignee: Balzers Aktiengesellschaft (LI) |
Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor
The present invention achieves the foregoing objectives by addressing the root cause of the foregoing non-uniformities, that is the non-uniformity of plasma enhancement provided by the rotating magnet... Read More
Inventors: Qian, Xue-Yu; Yin, Gerald; Hills, Graham W.; Steger, Robert;, Assignee: Applied Materials, Inc. (Santa Clara, CA) |
Coaxial microwave applicator for an electron cyclotron resonance plasma source
It is therefore an object of the present invention to provide a method and apparatus for producing plasma by means of electron cyclotron resonant heating that overcomes one or more of the disadvantage... Read More
Inventors: Dandl, Raphael A.;, Assignee: Applied Microwave Plasma Concepts, Inc. (La Jolla, CA) |
Aqueous magnetorheological material
OF THE INVENTION The compositions form a thixotropic network that is effective at minimizing particle settling and also in lowering the shear forces required to re-suspend the particles once they set... Read More
Inventors: Carlson, J. David;, Assignee: Lord Corporation (Cary, NC) |
Process for forming a contact structure
We claim: 1. A process for forming a contact in a multi-layer semiconductor device, comprising the steps of: depositing an imagable material directly on a substrate material, the imagable material hav... Read More
Inventors: Cooper, Kent J.; Woo, Michael P.; Ray, Wayne J.;, Assignee: Motorola Inc. (Schaumburg, IL) |
Method of forming studs and interconnects in a multi-layered semiconductor device
The present invention overcomes the disadvantages associated with the prior art methods of forming interconnects in multi-layer semiconductor devices. For example, the present invention reduces the po... Read More
Inventors: Shoda, Naohiro;, Assignee: Toshiba America Electronic Components, Inc. (Washington, DC) |
Ohmic electrode, its fabricating method and semiconductor device
It is therefore a first object of the invention to provide an ohmic electrode for GaAs semiconductor and other III-V compound semiconductors having practically satisfactory characteristics. A second o... Read More
Inventors: Murakami, Masanori; Oku, Takeo; Otsuki, Akira;, Assignee: Sony Corporation (Tokyo, JP) |
Method for joining heat-recoverable sheet material and resulting article
According to the present invention, the ends of heat-recoverable sheet material are joined by overlapping the ends of the material and disposing a laminar panel over the line defined by the uppermost ... Read More
Inventors: Caponigro, Dennis A.; Lopes, Eugene F.;, Assignee: Raychem Corporation (Menlo Park, CA) |
Cured pressure sensitive adhesives
What is claimed is: 1. Process for the preparation of an adhesive layer on a substrate which comprises applying to a substrate a composition of an acrylate rendered curable by the presence of a crossl... Read More
Inventors: Potter, William D.; Kiamil, Sinan B.;, Assignee: Smith and Nephew Associated Companies Ltd. (London, GB2) |
Recoverable article for encapsulation
We claim: 1. A dimensionally heat-recoverable article comprising a composite structure of a heat-recoverable fabric and a polymer matrix material, wherein: (a) the heat-recoverable fabric comprises fi... Read More
Inventors: Pithouse, Kenneth B.; Kridl, Thomas A.; Triplett, James T.;, Assignee: Raychem Corporation (Menlo Park, CA) |
Pressure sensitive adhesive release liner and fluorosilicone compounds, compositions and method therefor
OF THE INVENTION In a first aspect the present invention relates to a coating composition comprising a curable mixture consisting essentially of (A) a fluorosilicone polymer containing an average of ... Read More
Inventors: Brown, Paul L.; Stickles, David L.;, Assignee: Dow Corning Corporation (Midland, MI) |
Nonmetallic Processes 
