Carrier film and process for producing the same

DETAILED DESCRIPTION It is an object of the present invention to provide a carrier film in which a cover resist layer is formed on a heat-resistant resin film including a conductive wiring pattern, the cover resist layer having heat resistance, moisture resistance, close contact property, chemical resistance in a plating process or the like, and does not warp because contraction in resin hardening is small.
To achieve the above object of the present invention, there is provided a carrier film in which a cover resist layer made of epoxy acrylate resin including a fluorene skeleton is formed on a heat-resistant resin film including a conductive wiring pattern.
Furthermore, the carrier film which is remarkably flexuous and facilitates assembly of a semiconductor device can be obtained by forming the cover resist layer made of the epoxy acrylate resin including the fluorene skeleton by heating at temperature in a range of 180.
degree.
C.
to 260.
degree.
C.
for hardening.
Because the epoxy acrylate resin including the fluorene skeleton used in the present invention has photosensitivity, a through hole can be formed in a photo process like in a case where normal resist material is used.
Also, the hardened film has heat resistance of 300.
degree.
C.
or more and contraction of the film is small when hardened, thereby preventing warping of the carrier film.