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Electronic component packaging means, and supply mechanism for and method of supplying electronic components by using the electronic component packaging means
| Details |
Inventors: Takahashi, Tetsuo; Araya, Shinichi; Takahashi, Kuniaki; Mogi, Kunio; Kudo, Koji; Ito, Takeshi; Ikeda, Hiroshi;
Assignee: TDK Corporation (Tokyo, JP)
Primary Examiner: Noland; Kenneth W.
Assistant Examiner:
Attorney, Agent or Firm: Dann, Dorfman, Herrell and Skillman
Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at an upper position when the case is supported on the base, the outlet being faced upward, above which outlet the mounting head is adapted to wait. Also, an electronic component supply mechanism for and a method of supplying electronic components to the mounting head by using the packaging case are disclosed. |
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DETAILED DESCRIPTION The present invention has been made with a view to overcoming the foregoing problems of the prior art.
It is therefore an object of the present invention to provide packaging means for packing electronic components for storage and transportation as well as for supplying electronic components to a mounting head of an automatic electronic component mounting apparatus, which packaging means permits the mounting head to directly take each of electronic components out of the packaging means.
It is another object of this invention to provide electronic component packaging means which can be used as an electronic component supply source without causing the arranging position of carrying means, on which carrying means a printed circuit board is carried, to be restricted.
It is still another object of this invention to provide electronic component packaging means which can faciliate mounting of electronic components on printed circuit boards by the mounting head without causing the mounting head to be moved in many directions.
It is yet another object of this invention to provide electronic component packaging means which can facilitate reducing of the number of colliding of electronic components with one another during the movements of electronic components along a spiral passageway of the packaging means.
It is still a further object of this invention to provide a method and apparatus for supplying electronic components to the mounting head by using the electronic component packaging means as stated above.
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