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Method of preparing a photo-mask for imaging three-dimensional objects
| Details |
Inventors: Dumas, William V.; Karas, Bradley R.; Foust, Donald F.; Rose, James W.;
Assignee: General Electric Company (Schenectady, NY)
Primary Examiner: Bowers, Jr.; Charles L.
Assistant Examiner: Angebrandt; Martin
Attorney, Agent or Firm: Deshmukh; Sudhir G., Davis, Jr.; James C., Pittman; William H.
A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises a membrane transparent and degradation resistant to UV light, having at least one side with a contoured shape conforming, and flexible enough to comply with surface irregularities on the surfaces of the three-dimensional substrate being photo-imaged. A pattern of tracks opaque to UV light is posiitoned along the contoured shape of the membrane. The pattern of tracks on the photo-mask is in accordance with a desired conductive metal trace pattern on the surfaces of the three-dimensional printed circuit board substrate. The photo-mask is prepared by photo-imaging and then depositing a track material on a film that conformed to the surfaces of the three-dimensional substrate. An adhesive layer applied over the film cements a membrane material poured upon the adhesive layer. Once the membrane material sets into the membrane it is sepaarated from the substrate to form the photo-mask of the present invention. |
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DETAILED DESCRIPTION The present invention is directed to a method of preparing a photo-mask for exposing selected areas on surfaces of a three-dimensional substrate to light from a light source of a predetermined range of wavelength, said method comprising the steps of placing a film on a surface having holding means to hold said film fixedly in place, depositing an opaque layer on an exposed surface of said film, producing an opaque pattern thereon, removing said film from said holding means, aligning said film on said surfaces of said three-dimensional substrate with said exposed side having said opaque pattern in proximate contact with said surfaces, deforming said film to conform to a contoured shape of said surfaces, applying an adhesive layer on an unexposed side of said film, supplying a membrane material over said adhesive layer, setting said membrane material into a membrane wherein said membrane is cemented to said film by said adhesive layer, and separating said membrane from said substrate to form said photo-mask.
The photo-mask of the present invention is used for photo-imaging selected areas on the surfaces of a three-dimensional substrate to light from a light source of a predetermined range of wavelength.
The photo-mask has a membrane having at least one side contoured to conform to the surface of the substrate being photo-imaged by a light of predetermined wavelength, typically in the ultraviolet or visible range.
The membrane of the photo-mask is transparent to light from the light source being used for photo-imaging and is also resistant to degradation from said light.
The pattern on the contoured side of the photo-mask is provided by tracks opaque to the photo-imaging light.
The pattern of tracks positioned along the contoured side of the membrane of the photo-mask prevents the photo-imaging (actinic) light from reaching the non-selected areas on the surface of the substrate, thereby creating the desired pattern on the substrate.
The present invention contemplates a lightfield as well as a darkfield photo-mask, either one of which may be used with a positive or a negative photoresist in producing a desired conductive trace pattern on the surface of the substrate
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