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 Use of fresnel zone plates for material processing

Details
Inventors: Hunter, Jr., Robert O.; Smith, Adlai H.; Guest, Clark C.; McArthur, Bruce B.;
Assignee: Litel Instruments (San Diego, CA)
Primary Examiner: Dzierzynski; Paul M.
Assistant Examiner: Chang; Audrey
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP

Optical machining of a workpiece with coherent light scanning a plate with a plurality of subaperture subapertures is disclosed. Each of the subapertures creates a working image which when scanned with a coherent wave front of the design frequency forms in three dimensional space the working image. The working image when registered to a workpiece effect processing of the workpiece, usually ablating an aperture such as a blind via of small dimension. Improved techniques of dimensioning and fabricating the subaperture, creating amplitude modulation with the phase plate, and finally controlling amplitude with optical features close to the limit of producible optical elements is disclosed. The apparatus for the process, the process and the plate for utilization in the process are set forth.

DETAILED DESCRIPTION It is an advantage of the present invention to provide a system which uses diffractive optics techniques to form an arbitrary pattern for machining and material processing.
It is a further advantage of the present invention to permit the simultaneous processing of multiple areas within the field of view using approximately parallel beams of uniform power, and without having to step or scan the stage on which the workpiece is mounted.
It is another advantage of the present invention to permit highly accurate alignment of the diffractive optic with the workpiece to assure correct location of the beams.
In an exemplary embodiment the apparatus for drilling vias or holes in a circuit board includes an excimer laser and a Fresnel zone plate (FZP) positioned parallel to the circuit board, with the distance between the FZP and the circuit board being the focal length of the FZP.
For each via to be formed in the circuit board a corresponding FZP is patterned onto an FZP array.
Each FZP may be patterned directly centered over the desired via location or in high density patterns it may be located off-center from the via with deflection being accomplished by the formation of finer circular arcs on the side of the FZP opposite the desired direction of deflection.
General Plate Construction In the following description, certain terms will be used.
Although reflection is a candidate for the apparatus and process here set forth, transmission is preferred.
Reflection requires angularity between the plate producing working images and the workpiece.
A transmission mode of operation generally leads to simpler opto-mechanical arrangements and is therefore preferred.
Accordingly, and in the remainder of the text, where transmission is included, substitution of reflection will be understood.
As in the example above, it is the object of the method and apparatus to produce and describe optical plates.
Each plate will be divided into subapertures.
Each of these subapertures will produce one working image for incidence on a workpiece, typically for machining



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