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 Module and a substrate for the module

Details
Inventors: Matsumoto, Kunio; Noro, Takanobu; Kanda, Naoya;
Assignee: Hitachi, Ltd. (Tokyo, JP)
Primary Examiner: Envall, Jr.; Roy N.
Assistant Examiner:
Attorney, Agent or Firm: Antonelli, Terry & Wands

This invention relates to a module which mounts a plurality of semiconductor devices and to a module substrate that interconnect the semiconductor devices. This invention has the testing and engineering change pads on the underside of the substrate. This arrangement results in the advantages of: providing a sufficient area for the testing and engineering change pads; improving the package density of semiconductor devices, which in turn leads to higher computation speed; and eliminating the need for a special cooling system during the module testing, simplifying the process of testing. Furthermore, since the signal joint terminals to the semiconductor chips are provided on the surface of the substrate on which the semiconductor chips are mounted and since the power bus joint terminals are provided around the chips on the semiconductor chip-mounting surface of the substrate, it is possible to realize a high density package with high reliability.

DETAILED DESCRIPTION A primary object of the present invention is to provide a module and a module substrate used for the module, which clear two problems (1) reduced chip package density resulting from securing an area for the testing and engineering pads; and (2) the necessity of using a cooling system for module testing.
A second object of the invention is to provide a module that can (1) improve the cooling ability and (2) accommodate an increased number of joints and thereby improve the bonding efficiency.
The first object can be achieved in the present invention by providing the testing and engineering change pads on the underside of the substrate.
By placing on the underside of the substrate the testing and engineering change pads that have conventionally been arranged on the chip-mounting surface of the substrate around the periphery of the LSI chip, an area available for the pads increases by as much as the chip-mounting area, allowing an increased number of testing and engineering change pads to be accommodated.
This makes it possible to mount the LSI chips with greater density while securing a sufficient number of testing and engineering change pads.
Another advantage is that during module testing, the testing probe can be connected to the testing and engineering change pads from the underside of the substrate, which eliminates the need to remove the cooling means thermal-joined to the back of the chips and therefore requires no special cooling system for testing.
The second object is achieved in the present invention by placing input/output joint terminals to the semiconductor chips on the chip-mounting surface of the substrate and by arranging power bus joint terminals around the chips on the chip-mounting surface of the substrate.
The arrangement of the power bus joint terminals around the chips on the chip-mounting surface of the substrate allows the underside to be used only for input/output joints, which increases the joint-to-joint space thereby improving the bonding efficiency


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