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Curved lead configurations
| Details |
Inventors: DiStefano, Thomas H.; Smith, John W.;
Assignee: Tessera, Inc. (San Jose, CA)
Primary Examiner: Brown; Peter Toby
Assistant Examiner: Duong; Hung Van
Attorney, Agent or Firm: Lerner, David, Littenberg, Krumholz & Mentlik
A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end. |
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DETAILED DESCRIPTION In one embodiment of the invention, a microelectronic lead assembly for connecting first and second microelectronic elements comprises a structure defining a lead bearing surface, a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element.
The terminal end is disposed on the lead bearing surface and fixed to the surface-defining structure.
The tip end is releasably connected to the lead bearing surface and spaced apart on the lead bearing surface from the terminal end on an offset axis.
The lead assembly further comprises a first curved lead interconnecting the tip end and the terminal end, and a second curved lead interconnecting the tip end and the terminal end.
By providing two separate leads for interconnecting the microelectronic elements, reliability is increased through the use of redundant conductors, and inductance is reduced by the cancellation of parallel magnetic fields.
The two curved leads may be arranged on opposite sides of the offset axis, and may further be substantially symmetric across the offset axis.
The two leads may join the terminal end from substantially opposite directions, and may further join the tip end from substantially opposite directions.
The curved leads may bow away from the offset axis and away from one another between the tip end and the terminal end.
The terminal end may include a bulge, and the first and second curved leads may have tapered portions adjacent to the terminal end, wherein the leads gradually increase in width in directions along the curved leads toward the terminal end.
The structure defining the lead bearing surface may be a flexible, sheet-like structure, and the terminal end of the lead may be fixed to a via extending through that structure.
In another embodiment of the invention, the above-described microelectronic lead assembly having first and second curved leads interconnecting the tip and terminal ends may further have an extension portion extending substantially along the offset axis and connected at one end to one of the tip and terminal ends, and connected at the other end to the first and second curved leads
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Quantum Computing 
