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Direct dry negative color printing process and composition
| Details |
Inventors: Robillard, Jean J. A.;
Assignee: Scully; Richard L. (Charlottesville, VA)
Primary Examiner: Bowers, Jr.; Charles L.
Assistant Examiner: Chea; Thorl
Attorney, Agent or Firm: Birch, Stewart, Kolasch & Birch
The invention relates to a photosensitive composition for direct dry negative color printing composition. The photosensitive composition comprises a binder containing a plurality of grains of a semiconductor material, each grain having adsorbed on its surface one of three different complexes of spiropyran with a metal salt, each complex being sensitive to a different wavelength of light, a cross-linkable polymer and free radical initiator. The composition and process enables photofinishing or printing from a negative. |
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DETAILED DESCRIPTION I claim: 1.
A direct negative color photosensitive composition comprising a binder containing a plurality of grains of semiconductor each having absorbed on its surface one of three different photo-bleachable colored complexes of spiropyran with a metal salt, each complex being sensitive to a different wavelength of light of three colors viz.
yellow, magenta and cyan, a crosslinkable polymer, and a free radical initiator.
2.
The photosensitive composition of claim 1, wherein the binder is selected from the group consisting of polyvinyl alcohol, polyvinyl acetate, polyvinylpyrrolidone, carboxyethylcellulose, hydroxyethylcellulose and polyvinylchloride.
3.
The photosensitive composition of claim 1, wherein the semiconductor grains are made of an inorganic semiconductor selected from the group consisting of zinc oxide, tin oxide, titanium dioxide, zirconium oxide, lead oxide, lanthanum oxide and cerium oxide.
4.
The photosensitive composition of claim 1, wherein the semiconductor grains are made of an organic semiconductor of doped aromatic compounds selected from the group consisting of polyvinylcarbazole, polynaphthazarene, pyrazoline polymers, polyazines and polyphenylacetylene.
5.
The photosensitive composition of claim 1, wherein the spiropyran complexes adsorbed on the semiconductor grains are made of spiropyran selected from the group consisting of spiro 2.
3 diphenyl-7-methoxy-8'-nitro-[4H,1-benzopyran-4-3' [3H] naphto [2-1-b pyran], spiro 3-ethyl-8-methoxy-3'-methyl, 6-nitro [2H-1 benzopyran-2.
2' benzothiazoline] spiro 3,3'-dimethyl, 8-methoxy-6'-methylthio-6-nitro [2H-1-benzopyran-2,2' benzothiazoline] and spiro 8-methoxy-8'-nitro-3 phenyl bi-[2H-naphto [2,3b] pyran].
6.
The photosensitive composition of claim 1, wherein the semiconductor grains are made of an organic semiconductor of coordination metal complexes of polymers selected from the group consisting of Cu(I), Cu(II), Ni(II) and Pd(II) complexes of polyaminoquinone, polyvinyl alcohol, polydithioxamide, polythiocarbamic acid and polyquinoxalophenazine
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