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Method of manufacturing spatial light modulator and electronic device employing it
It is the object of the present invention to provide a spatial light modulator equipped with micromirrors which can be fabricated with a high yield, a method for ...
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Obstacle sensor operating by collimation and focusing of the emitted wave
I claim: 1. An obstacle sensor operating by collimation and focusing of emitted microwaves, said obstacle sensor including: a) a stabilized feeding unit (1); b) a lens ...
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Recording medium
OF THE PREFERRED EMBODIMENTS Reference is first made to the attributes of the record medium comprising this invention. In FIG. 1, there is shown a representative ...
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Method of and apparatus for the storage of radioactive waste
We claim: 1. A method of storing radioactive waste, comprising the steps of: (a) providing an upwardly open cast-iron vessel having a closed bottom, a solid wall unitary ...
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Semiconductor connection components and methods with releasable lead support
The present invention addresses these needs. One aspect of the present invention provides a semiconductor chip mounting component. A component according to this aspect ...
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Fabrication of leads on semiconductor connection components
The present invention addresses these needs. One aspect of the present invention provides methods for making a connection component for a microelectronic element. M...
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Curved lead configurations
In one embodiment of the invention, a microelectronic lead assembly for connecting first and second microelectronic elements comprises a structure defining a lead ...
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Semiconductor connection components and methods with releasable lead support
The present invention addresses these needs. One aspect of the present invention provides a semiconductor chip mounting component. A component according to this aspect ...
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Microelectronic assembly having slidable contacts and method for manufacturing the assembly
OF THE PREFERRED EMBODIMENTS This invention relates to a microelectronic assembly and a method for fabricating the microelectronic assembly. The microelectronic ...
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Semiconductor unit and method for manufacturing the same
OF THE INVENTION Hereinafter, the invention is further explained by referring to the following embodiments. (First Embodiment) FIGS. 1(a), (b) and (c) are cross-...
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