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Enhancements in framed sheet processing
| Details |
Inventors: Beroz, Masud; DiStefano, Thomas H.; Hendrickson, Matthew T.; Light, David; Smith, John W.;
Assignee: Tessera, Inc. (San Jose, CA)
Primary Examiner: Jones; Deborah
Assistant Examiner: Savage; Jason
Attorney, Agent or Firm: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated. |
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DETAILED DESCRIPTION The present invention addresses these needs.
One aspect of the present invention provides a framed sheet for use in manufacturing a microelectronic component.
The framed sheet in accordance with this aspect of the invention includes a flexible sheet having oppositely facing exterior surfaces and a frame having a structure defining an aperture.
The structure of the frame includes a light-transmissive portion.
The flexible sheet is bonded to the light-transmissive portion of the frame so that the sheet extends across the aperture and so that the frame holds the sheet taut, in tension.
The bond between the sheet and the light-transmissive portion of the frame is susceptible to degradation by exposure to light in a degradation wavelength band, and the light-transmissive portion of the frame is adapted to transmit light in such a degradation wavelength band.
Thus, the bond between the sheet and the light-transmissive portion of the frame can be released by applying light in the degradation wavelength band to the bond through the light-transmissive portion of the frame.
Most preferably, the flexible sheet includes a dielectric layer and at least one, and typically two, metallic layers overlying the dielectric layer at the exterior surfaces.
As is further discussed below, the metallic layers can be used to form parts of conductive elements such as leads in the finished component and also serve to stabilize the mechanical properties of the sheet.
However, the metallic layers make it impossible to apply degradation light to the bond between the sheet and frame through the flexible sheet.
The transparent frame allows application of the degradation light to the bond and thus quickly facilitates removal of the sheet from the frame and reclamation of the frame for reuse.
Most preferably, at least the light-transmissive portion of the frame, and preferably the entire frame structure, is formed from a transparent inorganic material.
The light-transmissive portion of the frame desirably is formed from a material selected from the group consisting of quartz, fused silica and glasses such as soda lime glass, borosilicate glasses and aluminosilicate glasses
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Quantum Computing 
