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 Method for fabricating a on-chip temperature controller by co-implant polysilicon resistor

Details
Inventors: Chen, Shui-Hung; Lin, Chrong Jung; Shih, Jiaw-Ren;
Assignee: Taiwan Semiconductor Manufacturing Company (Hsin-Chu, TW)
Primary Examiner: Nelms; David
Assistant Examiner: Hoang; Quoc
Attorney, Agent or Firm: Saile; George O., Ackerman; Stephen B., Stoffel; William J.

A method of manufacturing a on-chip temperature controller by co-implanting P-type and N-type ions into poly load resistors. The N and P type implant dose can be selected to create the desired cut-off temperature. First, a polysilicon layer 30 is formed on a first insulation layer 20. The polysilicon layer 30 is patterning to form a first poly-load resistor 30A and a second poly-load resistor 30B. The first and the second poly-load resistors are connected to a temperature sensor circuit 12. Both p-type and n-type impurity ions are implanted into the polysilicon layer 30. An insulating dielectric layer 40 is formed over the polysilicon layer 30 and the first insulating layer 20. The polysilicon layer is annealed. The contact openings 44 are formed through the ILD dielectric layer 40 exposing portions of the polysilicon layer 30. Contacts 50 to the polysilicon layer 30 thereby forming a first and second poly-load resistors which are used a temperature on-chip sensors. The first and second poly-load resistors can have different implant dose to get the desired cut off temperatures.

DETAILED DESCRIPTION It is an object of the present invention to provide a method for fabricating a resistor in an on-chip temperature sensor that has an easily controllable cut off temperature.
It is an object of the present invention to provide a method for fabricating a resistor in an on-chip temperature sensor that has an easily controllable resistivity that allows exact temperature cut off s point to be defined in a temperature controller.
It is an object of the present invention to provide a method for fabricating a resistor in a on-chip temperature sensor that has a easily controllable cut off temperature which is low cost and simple to manufacture.
It is an object of the present invention to provide a method for fabricating a resistor with both P and N type implanted impurities in a on-chip temperature sensor that has a easily controllable cut off temperature.
To accomplish the above objectives, the present invention provides a method of manufacturing an on-chip temperature controller including the steps of: forming a first insulation layer 20 over a semiconductor structure 10.
Next, we form a polysilicon layer 30 on the first insulation layer 20.
The polysilicon layer 30 is patterning to form a first poly-load resistor and a second poly-load resistor.
The first and the second poly-load resistors are connected to a temperature sensor circuit 12.
Both p-type and n-type impurity ions are implanted into the polysilicon layer 30.
An insulating (e.
g.
, interlevel dielectric (ILD)) dielectric layer 40 is formed over the polysilicon layer 30 and the first insulating layer 20.
The polysilicon layer is rapid thermal anneal the polysilicon layer at a Temperature in a range of between about 900 and 1100.
degree.
C.
for a time in a range of between about 10 and 20 seconds.
The polysilicon layer 30 preferably has a n-type impurity ion concentration in a range of between about 1E18 and 1E19 atoms/cm.
sup.
3 and a p-type impurity ion concentration in a range of between about 5E17 and 5E18 atoms/cm



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