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Method for mounting semiconductor device
| Details |
Inventors: Fukunaga, Akira; Nagasawa, Hiroshi;
Assignee: Ebara Corporation (Tokyo, JP)
Primary Examiner: Vo; Peter
Assistant Examiner: Trinh; Minh
Attorney, Agent or Firm: Browdy and Neimark, P.L.L.C.
Semiconductor devices can be mounted by the bump technique using compound metallic ultra-fine particles. Each particle comprises a core portion which is substantially a metallic component, with a coating layer chemically bound to the core portion, the coating layer being an organic substance. One of two bump technologies can be used to mount the semiconductor device, namely, forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals; or using paste balls comprising the compound metallic ultra-fine particles rather than ordinary solder balls. |
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DETAILED DESCRIPTION The present invention has been accomplished in light of the foregoing circumstances.
An object of the present invention is to provide a method for mounting a semiconductor device, the method enabling the solder bump method to be conveniently performed, and being capable of realizing a highly stable, low-cost, high reliability electrical connection, and also provide a mounted structure by this method.
Another object of the invention is to provide a method for mounting a semiconductor device, the method being capable of realizing a highly stable, low-cost, high reliability electrical connection, which has no risk of short-circuiting adjacent electrodes of even a narrow pitch; and a mounted structure of the semiconductor device produced by this method.
According to the present invention, there is provided a method, a structure and a system for mounting a semiconductor device by the bump technique using compound metallic ultra-fine particles each comprising a core portion consisting substantially of a metallic component, and a coating layer chemically bound to the core portion and comprising an organic substance.
The method, the structure and the system are characterized by using one of, or a combination of, the following two bump technologies: 1) Forming under bump metals from the compound metallic ultra-fine particles, and forming ordinary solder balls on the under bump metals.
2) Using paste balls comprising the compound metallic ultra-fine particles, instead of ordinary solder balls.
That is, an aspect of the present invention is a method for mounting a semiconductor device, comprising: preparing a metallic ultra-fine particle paste by dispersing compound metallic ultra-fine particles in a solvent, the compound metallic ultra-fine particles each comprising a core portion consisting substantially of a metallic component and a coating layer chemically bound to the core portion and comprising an organic substance; forming ultra-fine particle electrodes by attaching the metallic fine particle paste onto electrodes of the semiconductor device, followed by low temperature heat process; forming solder bumps on the ultra-fine particle electrodes; and connecting the solder bumps to terminal electrodes of a circuit board by heat fusing thereof
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