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 Method of forming integrated circuit dielectric by evaporating solvent to yield phase separation

Details
Inventors: Jin, Changming; Luttmer, Joseph D.;
Assignee: Texas Instruments Incorporated (Dallas, TX)
Primary Examiner: Fahmy; Wael
Assistant Examiner: Brewster; William M.
Attorney, Agent or Firm: Hoel; Carlton H., Brady; W. James, Telecky, Jr.; Frederick J.

A phase separation during solvent evaporation of a solution containing polymer precursors leaves low pressure solvent without polymer precursor in minimal gaps. After polymerization, drive off the low pressure solvent to yield air gaps in the minimal gaps under the polymer.

DETAILED DESCRIPTION The present invention provides silica xerogel dielectrics with essentially 100% porosity in minimal gaps but lower porosity in bulk regions to achieve mechanical strength for use as a multilevel integrated circuit dielectric.
This has the advantages of low dielectric constant in minimal gaps but with higher mechanical strength in bulk regions for manufacturability.



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