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Details
Inventors: Hatada, Kenzo;
Assignee: Matsushita Electric Industrial Co. Ltd. (Osaka, JP)
Primary Examiner: Hearn; Brian E.
Assistant Examiner: Quach; T. N.
Attorney, Agent or Firm: Wenderoth, Lind & Ponack

Disclosed is a method for making beam leads with projections and for joining such beam leads to electrodes of a semiconductor device. On a substrate (10), beam leads (12) with projections (12A) are concurrently formed using a single process. Semiconductor device (16) is pressed to beam lead (2) to join electrode (14) to projection (12A). When the semiconductor device is lifted, beam leads which are joined into the device are removed from the substrate. The concurrent formation of the beam leads (12) and projections (12A) can be carried out by plating using a substrate (10) having either a projection (10A) or a region (24A) of different resistance.

DETAILED DESCRIPTION It is, accordingly, a primary object of this invention to provide a method of manufacturing a semiconductor device which can solve the abovestated problems of conventional methods.
Another object of this invention is to provide a method of manufacturing a semiconductor device wherein connection inferiority due to expansion or distortion of a circuit does not occur and the yield rate of semiconductor devices is not lowered.
These and other objects are accomplished by a a method of manufacturing a semiconductor device which comprises a step of aligning a beam lead and an electrode of a semiconductor device, the beam lead being formed on a substrate, and a step of pressing the electrode of the semiconductor device to the beam lead on a substrate and of removing the beam lead from the substrate, whereby said beam lead is joined to said electrode of the semiconductor device.
In a specific embodiment, the beam lead has a projection which is formed at a position corresponding to the electrode of the semiconductor device.
The substrate has a projection for forming the projection of the beam lead.
The substrate has an electrically conductive layer thereon which has a low resistance portion and high resistance portion, the low resistance portion being used for forming the projection of the beam lead.
This invention also relates to a method of manufacturing a semiconductor device which comprises a step of forming beam leads by electro-plating opening patterns formed on a substrate which has the opening patterns at positions corresponding to electrodes of a semiconductor device, a step of aligning a beam lead and the electrode of the semiconductor device, a step of pressing the electrode of the semiconductor device to the beam lead on the substrate and of removing the beam lead from the substrate, the beam lead thereby being joined to said electrode of the semiconductor device, and a step of forming new beam leads by electro-plating the opening patterns of the substrate.
This invention provides various advantages, among which are as follows



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