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Microelectronic assembly having slidable contacts and method for manufacturing the assembly
| Details |
Inventors: Ghaem, Sanjar; Melton, Cindy;
Assignee: Motorola, Inc. (Schaumburg, IL)
Primary Examiner: Sparks; Donald
Assistant Examiner:
Attorney, Agent or Firm: Fekete; Douglas D.
A microelectronic assembly and a method for manufacturing the assembly include an integrated circuit component attached to a substrate via polymeric bodies. The integrated circuit component has bond pads that are bonded to corresponding conductive members. The substrate contains terminals associated with conductive traces. The conductive members rest against the respective terminals to form slidable electrical contacts. The slidable electrical contacts permit the transfer of electrical energy between the integrated circuit component and the conductive traces of the substrate. The polymeric bodies preferably comprise elastomers that are spaced from the conductive members, rather than underfilling the integrated circuit component. |
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS This invention relates to a microelectronic assembly and a method for fabricating the microelectronic assembly.
The microelectronic assembly generally comprises an integrated circuit component electrically connected to a substrate via slidable electrical contacts.
The slidable contacts form a compliant, bond-free electrical junction between terminals on the substrate and the leads, or pads, of the integrated circuit component.
Referring to FIG.
1 and 2, a first embodiment of the microelectronic assembly 21 generally includes a substrate 46, an integrated circuit component 20, conductive members, and polymeric bodies 50.
The substrate 46 preferably comprises a printed circuit board (PCB) or a printed wiring board (PWB).
The printed circuit board may be constructed from ceramic material, a polymer, a fiber-filled organic resin (i.
e.
FR4), or the like.
In alternate embodiments, an alternate substrate may comprise a carrier or an interposer.
A carrier or an interposer is a holder or a mounting interface for integrated circuit components.
For example, a carrier may be a first (smaller) circuit board for interfacing ball grid array (BGA) package to a second (larger) circuit board.
The substrate 46 has terminals 48 arranged in a first pattern.
The terminals 48 comprise pads that are associated with conductive traces of the substrate 46.
The conductive traces comprise metallic conductors, metallic traces, vias, plated holes, or the like.
The terminals 48 are suitably formed of a metal, preferably copper, nickel, tin, aluminum, or alloys of the foregoing.
Each terminal 48 is preferably coated with a corrosion-resistant metallic film, such as a noble metal layer.
The substrate 46 includes a component-attach region 68 outboard from a component-shadow region 70.
The component-shadow region 70 has its boundaries coextensive with the integrated circuit component 20.
That is, the component-shadow region 70 is defined by projecting a perimetric outline 82 of the integrated circuit component 20 onto the substrate 46
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