 Structure and method for manufacturing improved FETs having T-shaped gates |
| In view of the above, the invention is to provide a structure and method for manufacturing improved ... |
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| Method of fabricating a self-aligned silicide MOSFET |
| It is therefore an object of the invention to provide a reverse T-gate MOSFET device. The T-gate ... |
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| Partial silicidation method to form shallow source/drain junctions |
| This invention relates generally to semiconductor technology and more particularly to the formation ... |
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| Photopolymerization co-initiator systems |
| What is claimed is: 1. A photopolymerization co-initiator system which consists essentially of (a) ... |
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| Photosensitive resin composition containing pullulan or esters thereof |
| What is claimed is: 1. A photosensitive resin composition comprising 30 to 90 parts by weight of at ... |
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| Acyl benzyl ethers |
| What is claimed is: 1. A compound of the formula ##SPC4## where R.sub.1 and R.sub.2 each ... |
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| Photographic supports and elements utilizing photobleachable omicron-nitroarylidene dyes |
| I claim: 1. A process for preparing a photographic image which comprises imagewise exposing to ... |
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| Photo-imaging utilizing alkali-activated photopolymerizable compositions |
| What is claimed is: 1. The method of forming a polymeric image which comprises: a. providing photo-... |
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| Stabilization of photosensitive recording material |
| We claim: 1. A recording process including image stabilization comprising the steps of: 1. image-... |
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Plasma processing method for improving a package of a semiconductor device
| Details |
Inventors: Yamazaki, Shunpei; Tsuchiya, Mitsunori; Urata, Kazuo; Koyama, Itaru; Imatou, Shinji; Hayashi, Shigenori; Hirose, Naoki; Sasaki, Mari; Ishida, Noriya; Wada, Kouhei;
Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa, JP)
Primary Examiner: Chaudhuri; Olik
Assistant Examiner: Griffis; Andrew
Attorney, Agent or Firm: Sixbey, Friedman, Leedom & Ferguson
An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film. |
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DETAILED DESCRIPTION An object of the present invention is to provide, with due consideration to the drawbacks of such conventional devices, an electronic device in which the decrease in reliability is prevented.
Another object of the present invention is to provide a reliable device wherein an electronic device such as a semiconductor device or the like is wirebonded and molding is applied over the entire body of the electronic device.
Another object of the present invention is to use a non-product gas (a gas which does not decompose to form a film of a solid reaction product) for the plasma process to provide a densified layer, so that the surface of the molding modified into the densified layer, or a densified layer is formed on the surface of the molding.
Another object of the present invention is to prevent the development of cracking and swelling by improving the adherence of the die to the molding or protective film which adhere to the die.
Another object of the present invention is to provide a molding process which is carried out on the entire body of the device which has been wirebonded, so that the molding operation provides a densified layer on the surface in order to prevent entry of moisture from external sources into this molding.
In the present invention, there is no protective film formation (final coating) at the wafer level to prevent deterioration caused by water permeating the molding, but instead after the molding process (molding process by an organic resin), this film is provided on the outside of the electronic parts, by a plasma process using inert gas such as argon or a fluorinated gas over the molding after the molding process, or by using silicon nitride, "Diamond-Like Carbon" (DLC, referred to as so because it is carbon with the same sp3 bond as a diamond)), or the like over the molding after the molding process.
These objects are achieved in the present invention by the provision of a densified layer after completion of the molding process, which prevents the permeation of moisture into the moldings
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Quantum Computing 
