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 Semiconductor connection components and methods with releasable lead support

Details
Inventors: DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathiew, Gaetan;
Assignee: Tessera, Inc. (San Jose, CA)
Primary Examiner: Williams; Alexander Oscar
Assistant Examiner:
Attorney, Agent or Firm: Lerner, David, Littenberg, Krumholz & Mentlik, LLP

A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

DETAILED DESCRIPTION The present invention addresses these needs.
One aspect of the present invention provides a semiconductor chip mounting component.
A component according to this aspect of the invention includes a support structure having upper and lower surfaces and having a gap extending through the support structure, so that the gap extends downwardly from the upper surface to the lower surface.
The component also includes at least one electrically conductive lead.
Each such lead has a connection section extending across the gap in the support structure.
First and second ends of the connection section are secured to the support structure on opposite sides of the gap.
The second end of each connection section is secured to the support structure so that the second end can be displaced downwardly relative to the support structure responsive to a downward force applied to the connection section.
Each connection section is flexible, so that the connection section can be bent downwardly when the second end of the connection section is displaced downwardly relative to the support structure.
Thus, the connection section of each lead will be supported at both ends by the support structure during positioning of the component on a semiconductor chip assembly.
However, each connection section can be bent downwardly to engage a contact on a part of the semi-conductor chip assembly after the component has been positioned on the part.
Most preferably, the connection sections of the leads are connected to the support structure so that the first end of each such connection section is permanently connected to the support structure, whereas the second end of each such connection section is detachable from the support structure upon application of a downward force to the connection section.
The first end of each connection section typically is connected, by a further portion of the lead, to a terminal mounted on the support structure.
In a typical arrangement, the component is adapted to be positioned on the chip itself


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