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| 4-Aminothiazole |
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Semiconductor device and process for producing the same, and tape carrier used in said process
| Details |
Inventors: Ohtani, Hideya; Momoi, Toshimitsu; Ooi, Eiji; Sakuraba, Shuhei; Morita, Masayuki; Wakashima, Yoshiaki;
Assignee: Hitachi, Ltd. (Tokyo, JP)
Primary Examiner: Hearn; Brian E.
Assistant Examiner: Pawlikowski; Beverly A.
Attorney, Agent or Firm: Antonelli, Terry & Wands
According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length. This provision enables a plurality of semiconductor devices mounted on the tape carrier to be subjected to an aging, namely, a reliability test under a thermal environment and in the operating state, and hence an efficient reliability test can be achieved with an effect of the mass production. Consequently, a highly reliable semiconductor device can be provided. |
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DETAILED DESCRIPTION For the recent semiconductor devices, the higher reliability is required.
To this end, the aging is achieved as a reliability test in which a semiconductor device is subjected to an electrical operation state under a thermal environment of the state where the device is heated.
However, the tape carrier system is attended with a difficulty that the aging of a semiconductor device cannot be easily accomplished.
The inventor of the present invention has found that the problem is particularly considerable for a semiconductor which does not operate unless the power supply voltage associated with the electrical operation test is applied and the control signal is further supplied thereto.
The problem will be described in detail herebelow.
In a semiconductor device produced according to the tape carrier system, the lead thereof is formed with a copper foil having a thickness of about 35 .
mu.
m and is hence soft and easy to deform.
Consequently, the handling of the lead for each semiconductor is difficult, namely, cannot be easily effected.
This is because such a semiconductor device produced according to the tape carrier system is compact; and hence a great difficulty appears when manually transporting the device or when mounting the device in a tester for the device test.
As described above, therefore, also in the aging test, the handling of the compact semiconductor device having the leads produced in the tape carrier system is accompanied by a considerable difficulty.
Moreover, it is practically almost impossible in some cases to attach a terminal for the operation test to the thin-film lead which is soft and easy to deform and to perform for each compact semiconductor device an efficient aging test under a uniform, proper condition when a great number of such devices are to be tested.
Consequently, the operation test under a thermal environmental condition has not been conventionally accomplished hitherto, which makes it quite difficult to correctly detect a defective device or a semiconductor device having a latent defect
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Quantum Computing 
