Electro-optical device constructed with thin film transistors
An object of the present invention is to overcome the six problems mentioned above by taking balance among them and to provide a more economical electro-optical device at a high yield. This and other ... Read More
Inventors: Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Kanagawa, JP) |
Contact structure of an interconnection layer for a semiconductor device and a multilayer interconnection SRAM
One object of the present invention is to provide an interconnection structure which enhances reliability of a multilayer interconnection structure including a contact portion having large steps. Anot... Read More
Inventors: Sakamoto, Osamu;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Catalyst for the diminution of automobile exhaust gases
What is claimed is: 1. A process for producing a catalyst for the removal of carbon monoxide and hydrocarbons from automobile exhaust gases comprising the steps of: A. providing a substrate of a nicke... Read More
Inventors: Ford, James A.; Butt, Sheldon H.;, Assignee: Olin Corporation (New Haven, CT) |
Slurry phase syngas process
I claim: 1. A process for converting carbon monoxide and hydrogen to hydrocarbons which comprises contacting the carbon monoxide and hydrogen at a temperature ranging from about 175.degree. C. to abou... Read More
Inventors: Ryan, Robert C.;, Assignee: Shell Oil Company (Houston, TX) |
Atomic scale electronic switch
I claim: 1. An electronic switch comprising: (a) a plurality of terminals permanently fixed with respect to each other and spaced apart less than 100A; (b) an atom switching element having at least a ... Read More
Inventors: Eigler, Donald M.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Method of making planarized, self-aligned bipolar integrated circuits
The present invention is a method of making a bipolar integrated circuit structure in a semiconductor substrate comprising the steps of forming an implantation opening in a layer of insulating materia... Read More
Inventors: Liu, Michael S.; Chen, Huang-Joung;, Assignee: Honeywell Inc. (Minneapolis, MN) |
Self-aligned channel stop for trench-isolated island
In accordance with the present invention, the need to provide a separation region between the trench and a device region within the island, which results in an unwanted increase in occupation area, is... Read More
Inventors: Beasom, James D.;, Assignee: Harris Corporation (Melbourne, FL) |
Pallet disassembling method and apparatus
We claim: 1. A method for disassembling cargo carrying pallets which are constructed of a plurality of generally parallel, spaced-apart slats that are fastened to and extend laterally across the top a... Read More
Inventors: Lopez, Albert; Adams, James;, Assignee: Safeway Stores, Incorporated (Oakland, CA) |
Method of bonding silicon wafers at temperatures below 500 degrees centigrade for sensor applications
In general, the invention includes a process for silicon wafer-to-wafer bonding at temperatures lower than 500.degree. C. The process includes the steps of (1) treating the cleaned surfaces to make th... Read More
Inventors: Lee, Han-Sheng; Staller, Steven E.; Chilcott, Dan W.;, Assignee: Delco Electronics Corporation (Kokomo, IN) |
Electromagnetic actuator
An electromagnetic actuator according to an embodiment of the present invention comprises an external movable plate formed integrally with a semiconductor substrate. A first torsion bar swingably supp... Read More
Inventors: Asada, Norihiro;, Assignee: Nihon Shingo Kabushiki Kaisha (Saitama-Ken, JP) |
Method of manufacturing spatial light modulator and electronic device employing it
It is the object of the present invention to provide a spatial light modulator equipped with micromirrors which can be fabricated with a high yield, a method for manufacturing the same, and an electro... Read More
Inventors: Atobe, Mitsuro; Koeda, Hiroshi; Yotsuya, Shinichi;, Assignee: Seiko Epson Corporation (Tokyo, JP) |
Obstacle sensor operating by collimation and focusing of the emitted wave
I claim: 1. An obstacle sensor operating by collimation and focusing of emitted microwaves, said obstacle sensor including: a) a stabilized feeding unit (1); b) a lens antenna (5) operatively connecte... Read More
Inventors: Baldi, Franco;, Assignee: |
Recording medium
OF THE PREFERRED EMBODIMENTS Reference is first made to the attributes of the record medium comprising this invention. In FIG. 1, there is shown a representative example of such a medium. The medium ... Read More
Inventors: Kazan, Benjamin; Hagstrom, Stig B. M.;, Assignee: Xerox Corporation (Stamford, CT) |
Method of and apparatus for the storage of radioactive waste
We claim: 1. A method of storing radioactive waste, comprising the steps of: (a) providing an upwardly open cast-iron vessel having a closed bottom, a solid wall unitary therewith and an upwardly open... Read More
Inventors: Baatz, Henning; Rittscher, Dieter;, Assignee: GNS Gesellschaft fur Nuklear-Service mbH (Essen, DE) |
Semiconductor connection components and methods with releasable lead support
The present invention addresses these needs. One aspect of the present invention provides a semiconductor chip mounting component. A component according to this aspect of the invention includes a supp... Read More
Inventors: DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathiew, Gaetan;, Assignee: Tessera, Inc. (San Jose, CA) |
Fabrication of leads on semiconductor connection components
The present invention addresses these needs. One aspect of the present invention provides methods for making a connection component for a microelectronic element. Methods according to this aspect of t... Read More
Inventors: Smith, John W.; Fjelstad, Joseph;, Assignee: Tessera, Inc. (San Jose, CA) |
Curved lead configurations
In one embodiment of the invention, a microelectronic lead assembly for connecting first and second microelectronic elements comprises a structure defining a lead bearing surface, a terminal end for c... Read More
Inventors: DiStefano, Thomas H.; Smith, John W.;, Assignee: Tessera, Inc. (San Jose, CA) |
Semiconductor connection components and methods with releasable lead support
The present invention addresses these needs. One aspect of the present invention provides a semiconductor chip mounting component. A component according to this aspect of the invention includes a supp... Read More
Inventors: DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathiew, Gaetan;, Assignee: Tessera, Inc. (San Jose, CA) |
Microelectronic assembly having slidable contacts and method for manufacturing the assembly
OF THE PREFERRED EMBODIMENTS This invention relates to a microelectronic assembly and a method for fabricating the microelectronic assembly. The microelectronic assembly generally comprises an integr... Read More
Inventors: Ghaem, Sanjar; Melton, Cindy;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Semiconductor unit and method for manufacturing the same
OF THE INVENTION Hereinafter, the invention is further explained by referring to the following embodiments. (First Embodiment) FIGS. 1(a), (b) and (c) are cross-sectional views showing the manufactur... Read More
Inventors: Ono, Masahiro; Bessho, Yoshihiro;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Enhancements in framed sheet processing
The present invention addresses these needs. One aspect of the present invention provides a framed sheet for use in manufacturing a microelectronic component. The framed sheet in accordance with this ... Read More
Inventors: Beroz, Masud; DiStefano, Thomas H.; Hendrickson, Matthew T.; Light, David; Smith, John W.;, Assignee: Tessera, Inc. (San Jose, CA) |
Method for mounting semiconductor device
The present invention has been accomplished in light of the foregoing circumstances. An object of the present invention is to provide a method for mounting a semiconductor device, the method enabling ... Read More
Inventors: Fukunaga, Akira; Nagasawa, Hiroshi;, Assignee: Ebara Corporation (Tokyo, JP) |
Method of obtaining an impact ionization coefficient rate by junction of different kinds of semiconductors
It is an object of the present invention to provide a method of obtaining impact ionization coefficient rates by an artificially arranged substance structure, unlike the existing semiconductor substan... Read More
Inventors: Sakaki, Hiroyuki; Tanoue, Tomonori; Nojiri, Hidetoshi;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP); Sakaki; Hiroyuki (Kanagawa, JP) |
Semiconductor laser device
What is claimed is: 1. In a semiconductor laser device, the combination of an active layer that constitutes a laser-oscillating resonator, and an inner-striped channel formed on a substrate in the res... Read More
Inventors: Morimoto, Taiji; Yamaguchi, Masahiro; Kaneiwa, Shinji; Hayashi, Hiroshi; Kawanishi, Hidenori;, Assignee: Sharp Kabushiki Kaisha (Osaka, JP) |
Optical fiber cable provided with stabilized waterblocking material
Referring now to FIGS. 1 and 2, there is shown a communications cable which may incorporate the improved filling material of the present invention and which is designated generally by the numeral 20 ... Read More
Inventors: Kaufman, Stanley; Sheu, Jim J.;, Assignee: AT&T Bell Laboratories (Murray Hill, NJ) |
Geometrical control of device corner threshold
It is therefore an object of the present invention to provide a technique of adjustment of corner conduction in a field effect transistor which is independent of the channel conduction. It is another ... Read More
Inventors: Berry, Wayne S.; Faul, Juergen; Haensch, Wilfried; Mohler, Rick L.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Universal frequency synthesizer
OF THE INVENTION In the accompanying drawing, which forms a part of the specification and are to be read in conjunction therewith and in which like reference numerals are employed to indicate like pa... Read More
Inventors: Howk, Max E.; Slentz, Gale E.; Grillot, Ronald E.;, Assignee: King Radio Corporation (Olathe, KS) |
Multi-layer reflector for electroluminescent device
A multi-layer reflector is utilized on at least one facet surface of a semiconductor electroluminescent device capable of optical radiation emission in the wavelength range of 0.6 to 1.3 micrometers. ... Read More
Inventors: Ettenberg, Michael;, Assignee: RCA Corporation (New York, NY) |
Single filament semiconductor laser with large emitting area
A semiconductor laser includes a body of semiconductor material having a substrate with a pair of spaced, substantially parallel grooves in a surface thereof. A first confinement epitaxial layer is ov... Read More
Inventors: Botez, Dan;, Assignee: RCA Corporation (New York, NY) |
Semiconductor laser having a doped surface zone
What is claimed is: 1. A semiconductor laser having a semiconductor body comprising a resonator and a first passive semiconductor layer of a first coductivity type, an active semiconductor layer on sa... Read More
Inventors: de Waard, Peter J.;, Assignee: U.S. Philips Corporation (New York, NY) |
Quantum Computing 
