Planarization process for wide trench isolation
It is a primary object of this invention to provide an improved method for planarizing wide dielectric filled trenches in the surface of a semiconductor substrate. It is another object of this inventi... Read More
Inventors: Breiten, Charles P.; Stanasolovich, David; Theisen, Jacob F.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Method of manufacturing semiconductor devices using trench isolation method that forms highly flat buried insulation film
The object of this invention is to provide a method of manufacturing semiconductor devices whereby the insulating material can be buried in isolation trenches of different depths formed between circui... Read More
Inventors: Aomura, Kunio;, Assignee: NEC Corporation (JP) |
Method for forming semiconductor device isolating regions
It is an object of the present invention to provide a method for forming semiconductor device isolation regions by a trench burying isolation method, in which there is needed only a single lithography... Read More
Inventors: Kawamura, Akio;, Assignee: Sharp Kabushiki Kaisha (Osaka, JP) |
Uniform field oxidation for locos isolation
A principal object of the invention is to provide an effective and very manufacturable method to locally oxidize the silicon in an integrated circuit. Another object of the present invention is to pro... Read More
Inventors: Hong, Gary; Huang, Cheng H.; Pan, Hong-Tsz;, Assignee: United Microelectronics Corporation (Hsinchu, TW) |
Compound semiconductor light emitting device and method of preparing the same
An object of the present invention is to provide a compound semiconductor light emitting device of high performance solving the aforementioned problems, and a method which can industrially prepare the... Read More
Inventors: Miura, Yoshiki; Matsubara, Hideki; Matsushima, Masato; Seki, Hisashi; Koukitu, Akinori;, Assignee: Sumitomo Electric Industries, Ltd. (Osaka, JP) |
Method for formation of a stacked capacitor
OF THE PREFERRED EMBODIMENTS The following disclosure of the invention is submitted in furtherance with the constitutional purpose of the Patent Laws "to promote the progress of science and useful ar... Read More
Inventors: Liu, Yauh-Ching; Fazan, Pierre; Chan, Hiang; Rhodes, Howard E.; Dennison, Charles H.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Semiconductor wafer stacking apparatus and method
The invention is an apparatus and method for stacking, aligning, and mounting semiconductor wafers prior to mounting the stacked wafers for polishing the edges of the wafers. A plurality of wafers alt... Read More
Inventors: Dyer, Lawrence D.; McGregor, Dempsey; Montgomery, Robert M.; Medders, Jerry B.; Head, Michael R.; Gullett, Tom G.;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Process for depositing aluminum nitride (AlN) using nitrogen plasma sputtering
In accordance with the present invention a novel process for depositing a thin film of aluminum nitride (AlN) is provided. Simply stated, with the process of the invention an aluminum nitride (AlN) fi... Read More
Inventors: Kim, Sung C.; Yu, Chris C.; Doan, Trung T.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Avalanche photodiode
OF THE PREFERRED EMBODIMENTS The present invention overcomes the disadvantages of the conventional avalanche photodiode. The avalanche photodiode of the present invention comprises: a photo-electric ... Read More
Inventors: Wataze, Manabu; Takahashi, Kazuhisa; Takamiya, Saburo; Mitsui, Shigeru;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Junction isolated IC with thick EPI portion having sides at least 20 degrees from (110) orientations
OF THE PREFERRED EMBODIMENTS The present invention will now be described by reference to embodiments illustrated in the accompanying drawings. An embodiment in which a high breakdown voltage transist... Read More
Inventors: Imaizumi, Ichiro; Kimura, Masatoshi; Uehara, Keijiro;, Assignee: Hitachi, Ltd. (Tokyo, JP) |
Fiber optic scribe and cleave tool and method
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. Manually operable tool means for scribing and cleaving optic fibers of circular cross... Read More
Inventors: Margolin, Mark; Margolin, David;, Assignee: East-West Precision, Inc. (Chicago, IL) |
Optical fiber splicing station
The present invention provides an optical fiber splicing station generally comprising a base having an upper surface, a fiber splicing tool removably attached to the upper surface of the base, and mea... Read More
Inventors: Bossard, Ronald G.;, Assignee: Minnesota Mining and Manufacturing Company (St. Paul, MN) |
Large core fiber optic cleaver
OF THE INVENTION The present invention provides a device and method for the cleaving of optical fibers with core diameters equal to or greater than 400 .mu.m wherein the cleaved fibers possess high q... Read More
Inventors: Halpin, John M.;, Assignee: The United States of America as represented by the United States (Washington, DC) |
Optical fiber preparation unit
It is an object of the present invention to overcome the drawbacks of the prior art and provide a stripping device that does not scratch or bend a fiber. It is also an object of the present invention ... Read More
Inventors: Dodge, Shawn W.; Ware, Scot K.;, Assignee: Amherst International, Inc. (Brentwood, TN) |
Optical fiber stripping apparatus
According to the present invention, there is provided apparatus for removing a length of an outer protective layer from an end of an optical fiber. The apparatus comprises a retainer, a cutter, and fi... Read More
Inventors: Basavanhally, Nagesh R.;, Assignee: Lucent Technologies Inc. (Murray Hill, NJ) |
Apparatus for integrating steps of a process for interconnecting optical fibers
The present invention is therefore directed to an integrated and automated optical fiber interconnect workstation that substantially overcomes one or more of the problems due to the limitations and di... Read More
Inventors: Csipkes, Andrei; Chandler, William Keith; Mahmood, Waqar;, Assignee: Ciena Corporation (Linthicum, MD) |
Sheathed optical fiber cutting method and apparatus
What is claimed is: 1. A sheathed optical fiber cutting method for cutting the sheathed optical fiber, the method comprising: rotating the sheathed optical fiber around its center axis against a cutti... Read More
Inventors: Murakami, Akihiro; Yamazaki, Takanobu; Mikami, Toshihiro; Jie, Xu;, Assignee: The Furukawa Electric Co., Ltd. (Tokyo, JP) |
Method and apparatus for cleaning an optical fiber
According to one illustrated embodiment, an automated cleaning device for cleaning a portion of an optical fiber comprises a fluid tank assembly, an ultrasonic generator, a clamping assembly, and a co... Read More
Inventors: Johnson, III, Arthur W.; Watts, Jr., Harold G.; Christopher, Anthony J.; Sharon, Andre; Pretzch, Frank; Page, Mark S.;, Assignee: kSaira Corporation (Wilmington, MA) |
Rare-earth doped optical fiber module and manufacturing method therefor
It is therefore an object of the present invention to provide a rare-earth doped optical fiber module which can relieve the stress generated in winding a rare-earth doped optical fiber, thereby allowi... Read More
Inventors: Arima, Tadao;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Layered III-V semiconductor structures and light emitting devices including the structures
Accordingly, it is an object of the present invention to provide improved layered semiconductor structures and light emitting semiconductor devices using the layered structures, having most, if not al... Read More
Inventors: Sato, Shunichi;, Assignee: Ricoh Company, Ltd. (Tokyo, JP) |
Method for producing quantization functional device
The quantization functional device of this invention includes a silicon thin layer having a first surface and a second surface each made of a predetermined crystal surface. The silicon thin layer is f... Read More
Inventors: Morimoto, Kiyoshi; Yuki, Koichiro; Hirai, Yoshihiko; Morita, Kiyoyuki;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Semiconductor device and method of fabricating the same
It is an object of the present invention to provide a quantum semiconductor device having a new quantum wire structure and a quantum box, and a method of fabricating the same. It is another object of ... Read More
Inventors: Sakuma, Yoshiki; Sugiyama, Yoshihiro; Muto, Shunichi;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Method of making an optically nonlinear switched optical device and related devices
These and other needs are satisfied by the present invention which provides a method for making a nonlinear optical device and a related optical device. The filter effectively resists transmission of ... Read More
Inventors: Asher, Sanford A.; Chang, Song-Yuan; Jagannathan, Seshadri; Kesavamoorthy, Rasu; Pan, Guisheng;, Assignee: University of Pittsburgh of the Commonwealth System of Higher Education (Pittsburgh, PA) |
Reversible thermoelectric converter
According to the present invention, these and other objects and advantages are achieved in a reversible thermoelectric converter comprising a first device, or element, and a second device, or element.... Read More
Inventors: Yater, Joseph C.; Yater, Jane A.; Yater, Joan E.;, Assignee: |
Interband lateral resonant tunneling transistor
It is the objective of this invention to provide a resonant tunneling device based on resonant tunneling processes in narrow-gap nanostructures capable of driving follow-on devices within the electron... Read More
Inventors: Meyer, Jerry R.; Hoffman, Craig A.; Bartoli, Jr., Filbert J.;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
Semiconductor device and electronic device by use of the semiconductor
An object of the present invention, in view of the above-mentioned state of the art as described above, is to provide a semiconductor device which can maintain a high current amplification ratio over ... Read More
Inventors: Morishita, Masakazu;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Logic or memory element based on n-stable phase-locking of single-electron tunneling oscillation, and computer using the same
It is a main object of the present invention to provide a SET element capable of contributing to the configuration of a novel computer which is not subject to scaling limitations and the limitations i... Read More
Inventors: Ohshima, Toshio; Kiehl, Richard A.;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Nonvolatile memory
In accordance with one aspect of the present invention, an electrically erasable and programmable read-only memory includes a sensing cell with a floating gate electrode, a channel, a source and a dra... Read More
Inventors: Wong, Ting-wah;, Assignee: Programmable Silicon Solutions (Sunnyvale, CA) |
Memory cell for EEPROM devices and corresponding fabricating process
Accordingly, set forth is an EEPROM cell formed on a semiconductor material substrate having a first conductivity type, the memory cell including a drain region having a second conductivity type and e... Read More
Inventors: Vajana, Bruno; Cremonesi, Carlo; Bottini, Roberta; Dalla Libera, Giovanna;, Assignee: SGS-Thomson Microelectronics, S.r.l. (Agrate Brianza, IT) |
Nonlinear optical thin-film
One object of the present invention is to provide nonlinear optical thin-films which exhibit a large optical nonlinearity. Another object of the present invention is to provide nonlinear optical thin-... Read More
Inventors: Mitsuyu, Tsuneo; Ohkawa, Kazuhiro; Karasawa, Takeshi;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Quantum Computing 
