Solid state laser device for lithography light source and semiconductor lithography method
What is claimed is: 1. A solid state laser device useful as a light source for lithography: comprising: a solid state laser emitting ray of light, a nonlinear optical material for converting a wavelen... Read More
Inventors: Itani, Akira; Shimazaki, Kazuo;, Assignee: Mitsui Petrochemical Industries, Ltd. (Tokyo, JP) |
Apparatus for cooling integrated circuit chips
In one aspect of the present invention, this is accomplished by providing an apparatus for cooling integrated circuit chips including a housing having at least one board mounted therein and a pluralit... Read More
Inventors: Mathias, Joseph S.; Mittal, Faquir C.;, Assignee: Sperry Corporation (New York, NY) |
Cooled stack of electrically isolated semiconductors
I claim: 1. A heat sink structure comprising: a thin sheet of electrical insulating material; first and second electrically conductive heat sink elements each having a planar surface and an opposite s... Read More
Inventors: Sutrina, Thomas A.;, Assignee: Sundstrand Corporation (Rockford, IL) |
Apparatus and method of automatically separating stacked wafers
It is an object of the present invention to provide an apparatus which avoids these disadvantages and makes it possible to lift the wafers automatically off the wafer stack without mechanical contact ... Read More
Inventors: Frank, Walter; Pemwieser, Albert; Spatzier, Gerhard;, Assignee: Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH (Burghausen, DE) |
Plasma immersion ion implantation (PI.sup.3) apparatus
OF THE INVENTION The prior art PI.sup.3 structures and methods of Conrad as described in U.S. Pat. No. 4,764,394 employ a so called hot cathode process which continuously maintains a plasma to genera... Read More
Inventors: Sheng, Terry T.;, Assignee: Varian Associates, Inc. (Palo Alto, CA) |
Surface treatment of magnetic recording heads
The present invention is directed to a surface treatment for magnetic recording heads and other ceramic articles or substrates. A ceramic substrate, for example, may be held on a conductive substrate ... Read More
Inventors: Komvopoulos, Kyriakos; Brown, Ian G.; Wei, Bo; Anders, Simone; Anders, Andre; Bhatia, Singh C.;, Assignee: International Business Machines, Inc. (New York, NY); Regents of the University of California (Oakland, CA) |
Method of making semiconductor device with multiple transparent layers
An object of the present invention is to preserve a silicon oxide film or a transparent film during the course of etching a thin silicon film to form silicon islands or during the course of etching a ... Read More
Inventors: Hayashi, Yutaka; Takahashi, Kunihiro; Takasu, Hiroaki; Kojima, Yoshikazu; Niwa, Hitoshi; Matsuyama, Nobuyoshi; Yoshino, Yomoyuki; Kamiya, Masaaki;, Assignee: Agency Industrial Science (JP); Seiko Instruments Inc. (JP) |
A SOI substrate fabricating method
It is therefore an object of the invention to provide a SOI substrate fabricating method capable of fabricating a SOI substrate in which a silicon layer with small TTV, uniform film thickness and smal... Read More
Inventors: Matsushita, Takeshi; Morita, Etsuo; Nakajima, Tsuneo; Hasegawa, Hiroyuki; Shingyouji, Takayuki;, Assignee: Sony Corporation (Tokyo, JP); Mitsubishi Materials Corporation (Tokyo, JP); Mitsubishi Materials Silicon Corporation (Tokyo, JP) |
Process of fabricating a semiconductor substrate with semi-insulating polysilicon gettering site layer
It is therefore an important object of the present invention to provide a semiconductor substrate, which achieve good gettering efficiency without serious warp. It is also an important object of the p... Read More
Inventors: Hamada, Koji;, Assignee: NEC Corporation (Tokyo, JP) |
Distance measuring apparatus
It is a first object of the present invention to provide an apparatus which has a plurality of light-emitting means and a plurality of light-receiving means and in which the range of distance to be me... Read More
Inventors: Kawabata, Takashi;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Micropositioning apparatus for a robotic arm
It is therefore a goal of the present invention to provide a precise micropositioning system for a robotic arm. This goal is achieved in the present invention by providing an apparatus which determine... Read More
Inventors: Bartholet, Stephen J.;, Assignee: Odetics, Inc. (Anaheim, CA) |
Station for detecting and locating through laser beams an object or a substance likely to diffuse back at least one part of the incident laser ray and system for sensing a substance such as smoke in particular of a fire such as a forest fire
The present invention aims at coping with this inconvenience of the known stations. To reach that aim, a station according to the present invention is characterized in that the optical emitter and rec... Read More
Inventors: Brown de Colstoun, Francois; Chambaret, Jean-Paul; Chambaret, Yves; Le Saige de la Villesbrunne, Arnaud G.; Moscovici, Jean-Claude M.;, Assignee: |
Cooling system and mounting for slab lasers and other optical devices
AND OBJECTS It is a general object of the present invention to provide a cooling system and mounting for solid state pumped slab lasers which will overcome the above limitations and disadvantages. It ... Read More
Inventors: Basu, Santanu;, Assignee: Northrop Grumman Corporation (Los Angeles, CA) |
Liquid cooled connector for integrated circuit packages
In accordance with the present invention, a new and improved connector is disclosed for mounting and electrically interconnecting an integrated circuit package and a backpanel, with the connector havi... Read More
Inventors: Cutchaw, John M.;, Assignee: |
High current press pack semiconductor device having a mesa structure
An object of the present invention is to provide a press pack semiconductor device having satisfactory electric characteristics. Another object of the present invention is to provide a press pack semi... Read More
Inventors: Iwasaki, Masami;, Assignee: Tokyo Shibaura Denki Kabushiki Kaisha (Kawasaki, JP) |
Multi-chip carrier array
In order to overcome the problems described in the previous section which are inherent in the multiple-chip carrier arrays which have the major axes of the oblong perforations coincidental with the sc... Read More
Inventors: Daniel, Robert P.; Yglesia, Larry;, Assignee: |
Method and apparatus for producing a radiological image of an object
I claim: 1. The method of producing a radiological image of an object having a plurality of subfield areas comprising the steps of providing an X-ray focal spot and a detector unit with the detector u... Read More
Inventors: Warrikhoff, Harald F. H.;, Assignee: |
High density multi-layered integrated circuit package
OF THE PREFERRED EMBODIMENT Referring now to FIG. 1 wherein there is shown a detector subarray including a plurality of modules 11 that may be formed in accordance with the present invention. Sub-arr... Read More
Inventors: Schmitz, Charles E.; Wimberly, Richard C.; Carlson, Donald J.;, Assignee: Grumman Aerospace Corporation (Bethpage, NY) |
Radiation imaging apparatus and methods
Among the objects of the present invention are to provide radiation imaging apparatus in which the photomultiplier tubes or other sensors need not be moved either for reasons of complete specimen obse... Read More
Inventors: Logan, K. William;, Assignee: The Curators of the University of Missouri (Columbia, MO) |
Method of making a nonplanar buried-heterostructure distributed-feedback laser
The Figure shows substrate 1, typically including a deposited buffer layer of n-indium phosphide, a p-indium phosphide layer 2, and an n-indium phosphide layer 3. These layers are typically deposited... Read More
Inventors: Dolan, Gerald J.; Logan, Ralph A.; Temkin, Henryk; Wilt, Daniel P.;, Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories (Murray Hill, NJ) |
Anisotropic titanate etch
OF THE PREFERRED EMBODIMENT(S) In the preferred embodiment of this invention and with reference to FIG. 1, a pattern is etched into a substrate 34 of lead zirconate titanate (PbTiZrO.sub.3) which is ... Read More
Inventors: Douglas, Monte A.; Beratan, Howard R.; Summerfelt, Scott R.;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Circuit for interfacing remote functional units to a terminal
The present invention is a circuit for interfacing one or more remote functional units to a terminal device which also has one or more integrated functional units which communicate optically by means ... Read More
Inventors: Harbour, Edward E.; Lynch, Robert C.; Stilwell, Jr., George R.;, Assignee: International Business Machines Corp. (Armonk, NY) |
Method of manufacturing SOI semiconductor element
It is, therefore, a principal object of the present invention to provide a method of manufacturing an SOI semiconductor element capable of solving a conventional problem of failure in a high-speed ope... Read More
Inventors: Omura, Yasuhisa; Kunii, Yasuo; Izumi, Katsutoshi;, Assignee: Nippon Telegraph & Telephone Corporation (JP) |
Method of making trench EEPROM structure on SOI with dual channels
An EEPROM with FN tunneling normally requires a higher voltage and consequently a large power supply voltage or high coupling factor in order to accelerate electrons across the oxide between the contr... Read More
Inventors: Acovic, Alexandre; Wu, Ben S.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Method of manufacturing an insulated gate semiconductor device
A first aspect of the present invention relates to an insulated gate semiconductor device, comprising: a first semiconductor layer of a first conductivity type, the first semiconductor layer including... Read More
Inventors: Takahashi, Hideki;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Integrated circuit
The present invention helps to alleviate the problems caused by stepper astigmatism by providing an integrated circuit with a plurality of transistors in which each gate extends over an active region ... Read More
Inventors: Lee, Kuo-Hua; Nagy, William J.; Sung, Janmye;, Assignee: AT&T Bell Laboratories (Murray Hill, NJ) |
Semiconductor memory device and a manufacturing method thereof
Accordingly, it is an object of the present invention to provide a semiconductor memory device which enables reliable metallization by minimizing the step between the cell array region and peripheral ... Read More
Inventors: Ahn, Ji-hong;, Assignee: Samsung Electronics Co., Ltd. (Kyunggi-do) |
Segmented flow laser cavity
What is claimed is: 1. An article of manufacture for use in the active region of a gas laser comprising: a plurality of identical segments; each segment comprising a generally rectangular solid having... Read More
Inventors: Pierce, Russell W.; Rogers, Fred T.;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
Laser for generating white light
What is claimed is: 1. A laser tube responsive to a predetermined voltage applied thereto for producing a discharge therein comprising: a gas-filled envelope having a longitudinal axis, an anode elect... Read More
Inventors: Wang, Shing Chung;, Assignee: Xerox Corporation (Stamford, CT) |
Light sensitive electronic devices
I claim: 1. A light sensitive electronic device comprising an iron substrate and a layer of cadmium telluride having one side thereof bonded to and making an ohmic connection with said iron substrate.... Read More
Inventors: Wald, Fritz;, Assignee: Mobil Tyco Solar Energy Corporation (Waltham, MA) |
Quantum Computing 
