Chip to board bus connection

DETAILED DESCRIPTION What is claimed is: 1.
A chip to circuit board interconnection assembly comprising a plurality of semiconductor chips mounted on said board, a plurality of contact pads on each chip of said plurality of chips, a plurality of contact pads on said board, each of said board pads having a bonding axis pointed generally at a different one of said chip pads, a plurality of electrical conductor lines on said board, said lines connecting to opposite sides of said bonding axis of said board pads, said lines and said board pads being spaced from adjoining ones of said lines and said board pads to form a bus following a path which is directed alternately toward and away from said chips, said bus having alternating sections, one of said sections displacing said bus toward said chips and the other of said sections displacing said bus away from said chips.
2.
The assembly as in claim 1 in which said board pads for at least one of said chips has the most distant board pad generally opposite the center of said one chip with board pads and parts of lines alternating on each side of said most distant board pad with each board pad next closer to one side of said chip having a bonding axis pointing at a chip pad farther away from said center of said one chip on that side of said one chip.
3.
The assembly as in claim 2 in which said lines and said board pads are generally equally spaced from adjoining ones of said lines and said board pads.
4.
The assembly as in claim 3 in which at least some of said lines have a part extending from said board pad to which it is connected generally in the direction of the bonding axis of that board Pad and forming a part of one of said sections, said extending parts being located on the side of said board pads away from said chips to separate said lines more in the region between said chips than said lines are separated in the region proximate to at least one of said chips.
5.
The assembly as in claim 2 in which at least some of said lines have a part extending from said board pad to which it is connected generally in the direction of the bonding axis of that board pad and forming a part of one of said sections, said extending parts being located on the side of said board pads away from said chips to separate said lines more in the region between said chips than said lines are separated in the region proximate to at least one of said chips