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Multi-layer shield for absorption of electromagnetic energy
| Details |
Inventors: Powell, Thomas A.;
Assignee: Lucent Technologies Inc. (Murray Hill, NJ)
Primary Examiner: Kincaid; Kristine L.
Assistant Examiner: Horgan; Christopher
Attorney, Agent or Firm:
A multi-layer structure for shielding electromagnetic energy in a data processing equipment enclosure. The multi-layer structure includes a first layer formed of a first material having a first set of electromagnetic properties and a textured surface and at least one further layer stacked behind the first layer and formed of at least one further material having a second set of electromagnetic properties, the second set of electromagnetic properties being different than the first set. The first and further layer are configured to absorb the electromagnetic energy and dissipate the energy as heat within the multi-layer structure. |
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The preferred embodiment of the present invention is discussed in detail below.
While specific steps, configurations and arrangements are discussed, it should be understood that this is done for illustration purposes only.
A person skilled in the relevant art will recognize that other steps, configurations and arrangements may be used without departing from the spirit and scope of the invention.
The preferred embodiment of the invention is now described with reference to the figures where like reference numbers indicate identical or functionally similar features.
Also in the figures, the left-most digit of each reference number corresponds to the figure in which the reference number is first used.
The present invention is a multi-layer structure for mounting within an enclosure, such as a transmitter chassis, or the like.
The multi-layer structure is designed to substantially reduce spurious transmissions from a source within the data processing equipment enclosure by absorbing the EM energy and dissipating the EM energy as heat within the multi-layer structure.
The transmission coefficient of the multi-layer structure is very low; meaning that the majority of the EM energy does not leave a region enclosed by the multi-layer structure.
For example, a transmitter can have its inner chassis walls coated with the multi-layer structure of the present invention.
The multi-layer structure is formed by stacking various layers of dielectric, conductive, and/or polymer materials together.
The impedances of the stacked materials are selected to maximize absorption of the spurious EM energy.
The effective impedance of the multi-layer structure is changed by selecting different combinations of materials to change the effective properties of the shielding structure.
Further background concerning materials to be used in connection with the present invention can be found in a number of references, including U.
S.
Pat.
No.
4,948,922 to Varandan et al.
titled, "Electromagnetic Shielding and Absorptive Materials," U
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